发明授权
- 专利标题: Laminate
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申请号: US11134655申请日: 2005-05-20
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公开(公告)号: US07101619B2公开(公告)日: 2006-09-05
- 发明人: Masaru Nishinaka , Takashi Itoh , Kanji Shimo-Ohsako
- 申请人: Masaru Nishinaka , Takashi Itoh , Kanji Shimo-Ohsako
- 申请人地址: JP Osaka
- 专利权人: Kaneka Corporation
- 当前专利权人: Kaneka Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: Brinks Hofer Gilson & Lione
- 优先权: JP2000-328125 20001027
- 主分类号: B32B7/12
- IPC分类号: B32B7/12 ; B32B15/08
摘要:
The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 μm. The present invention also relates to a laminate comprising a metal layer having a thickness of at most 5 μm on one or both faces of a synthetic resin film, wherein the synthetic resin film is a polyimide film obtained by immersing a partially imidized or partially dried poly(amide acid) film in a solution of a compound containing at least one element selected from the group consisting of aluminum, silicon, titanium, manganese, iron, cobalt, copper, zinc, tin, antimony, lead, bismuth and palladium or by applying the solution to the film, and then completely drying and imidizing the poly(amide acid) film, the resulting polyimide film containing at least one of the elements.
公开/授权文献
- US20050221080A1 Laminate 公开/授权日:2005-10-06