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公开(公告)号：US07115681B2
公开(公告)日：2006-10-03
申请号：US10482897
申请日：2002-07-08
IPC分类号： C08L79/08
CPC分类号： H05K1/0346 , C08G59/08 , C08G59/5033 , C08L63/00 , C08L79/08 , C08L2666/20 , C08L2666/22
摘要： The present invention provides a resin composition comprising a polyimide containing particular dianhydride and diamine, and an epoxy resin. The resin composition can be bonded at a relatively low temperature, has excellent heat resistance, adhesion property, soldering heat resistance and retaining ratio of peeling strength after PCT. By forming a circuit using the polyimide resin sheet or the polyimide resin sheet with metal foil, which comprises the resin composition, according to the semi-additive method, a printed wiring board having a good wiring shape, firm adhesion of circuit and high insulating resistance in the microcircuit space can be obtained.
摘要翻译： 本发明提供一种包含含有特定二酐和二胺的聚酰亚胺和环氧树脂的树脂组合物。 树脂组合物可以在相对较低的温度下结合，具有优异的耐热性，粘附性，耐焊接性和PCT后剥离强度的保持率。 通过使用包含该树脂组合物的金属箔的聚酰亚胺树脂片或聚酰亚胺树脂片根据半添加方法形成具有良好布线形状，电路牢固牢固和绝缘电阻高的印刷线路板的电路 在微电路空间可以获得。
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公开(公告)号：US20050221080A1
公开(公告)日：2005-10-06
申请号：US11134655
申请日：2005-05-20
CPC分类号： B32B15/08 , B32B27/34 , H05K1/0346 , H05K3/025 , H05K3/146 , H05K3/181 , H05K3/386 , H05K3/4626 , H05K2201/0154 , H05K2201/0195 , Y10T428/24917 , Y10T428/26 , Y10T428/266 , Y10T428/2804 , Y10T428/31678 , Y10T428/31681
摘要： The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 μm. The present invention also relates to a laminate comprising a metal layer having a thickness of at most 5 μm on one or both faces of a synthetic resin film, wherein the synthetic resin film is a polyimide film obtained by immersing a partially imidized or partially dried poly(amide acid) film in a solution of a compound containing at least one element selected from the group consisting of aluminum, silicon, titanium, manganese, iron, cobalt, copper, zinc, tin, antimony, lead, bismuth and palladium or by applying the solution to the film, and then completely drying and imidizing the poly(amide acid) film, the resulting polyimide film containing at least one of the elements.
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3.发明申请Thermosetting Resin Composition, And Laminate and Circuit Substrate Using Same 审中-公开热固性树脂组合物，层压板和电路基板公开(公告)号：US20080312383A1
公开(公告)日：2008-12-18
申请号：US12033748
申请日：2008-02-19
IPC分类号： C08G73/10
CPC分类号： H05K1/0353 , C08G59/4014 , C08L63/00 , C08L79/08 , H05K2201/0154 , C08L2666/20 , C08L2666/22
摘要： A thermosetting resin composition of the present invention includes (A) a polyimide resin, and as thermosetting components, at least one of (B) a multifunctional cynate ester and (C) an epoxy resin. The (A) polyimide resin is soluble polyimide obtained by reacting, with diamines, acid dianhydride including an ether bond. As (B) the multifunctional cynate esters, a compound having a specific structure, and/or an oligomer thereof is used. As (C) the epoxy resin, an epoxy resin having a dicyclopentadiene bone structure and/or an alkoxy-group-including silane denatured epoxy resin (suitable epoxy resin) is preferably used.
摘要翻译： 本发明的热固性树脂组合物包含（A）聚酰亚胺树脂，作为热固性成分，可以使用（B）多官能酯类酯和（C）环氧树脂中的至少一种。 （A）聚酰亚胺树脂是通过与二胺，包括醚键的酸二酐反应获得的可溶性聚酰亚胺。 作为（B）多功能的Cynate酯，使用具有特定结构的化合物和/或其低聚物。 作为（C）环氧树脂，优选使用具有二环戊二烯骨结构的环氧树脂和/或含烷氧基的硅烷变性环氧树脂（适合的环氧树脂）。
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公开(公告)号：US06911265B2
公开(公告)日：2005-06-28
申请号：US10169327
申请日：2001-10-26
IPC分类号： B32B15/08 , B32B27/34 , H05K1/03 , H05K3/02 , H05K3/14 , H05K3/18 , H05K3/38 , H05K3/46 , B32B7/12
CPC分类号： B32B15/08 , B32B27/34 , H05K1/0346 , H05K3/025 , H05K3/146 , H05K3/181 , H05K3/386 , H05K3/4626 , H05K2201/0154 , H05K2201/0195 , Y10T428/24917 , Y10T428/26 , Y10T428/266 , Y10T428/2804 , Y10T428/31678 , Y10T428/31681
摘要： The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 μm. The present invention also relates to a laminate comprising a metal layer having a thickness of at most 5 μm on one or both faces of a synthetic resin film, wherein the synthetic resin film is a polyimide film obtained by immersing a partially imidized or partially dried poly(amide acid) film in a solution of a compound containing at least one element selected from the group consisting of aluminum, silicon, titanium, manganese, iron, cobalt, copper, zinc, tin, antimony, lead, bismuth and palladium or by applying the solution to the film, and then completely drying and imidizing the poly(amide acid) film, the resulting polyimide film containing at least one of the elements.
摘要翻译： 本发明提供了一种用于印刷布线基板和多层印刷布线板的层压板，其具有高耐热性，窄间距布线图案，具有小直径的通孔，具有均匀厚度的绝缘层和金属层与 合成树脂膜，有助于电子设备的小型化，高性能和功能改进。 本发明涉及一种金属层压体，其包括层压在合成树脂膜的一面或两面上的金属层，其中该金属层是厚度至多为5um的金属箔。 本发明还涉及一种层压体，其包括在合成树脂膜的一面或两面上具有至多5um厚度的金属层，其中所述合成树脂膜是通过将部分酰亚胺化或部分干燥的聚 （酰胺酸）膜在含有选自铝，硅，钛，锰，铁，钴，铜，锌，锡，锑，铅，铋和钯中的至少一种元素的化合物的溶液中，或通过应用 对该膜的溶液，然后完全干燥和酰亚胺化聚（酰胺酸）膜，所得聚酰亚胺膜含有至少一种元素。
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5.发明授权公开(公告)号：US08313831B2
公开(公告)日：2012-11-20
申请号：US10537959
申请日：2003-12-12
IPC分类号： B32B27/00
CPC分类号： H05K1/0346 , B32B7/10 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/16 , B32B27/281 , B32B2250/03 , B32B2274/00 , B32B2307/204 , B32B2307/206 , B32B2307/306 , B32B2307/5825 , B32B2307/734 , B32B2457/00 , B32B2457/08 , C23C18/1653 , C23C18/22 , C23C18/26 , C23C18/38 , H05K1/036 , Y10T29/49126 , Y10T29/49155 , Y10T428/12493 , Y10T428/24917 , Y10T428/249991
摘要： The present invention provides a laminate having a two-layer or three-layer structure including a non-thermoplastic polyimide film and a thermoplastic polyimide layer provided on one or both of the surfaces thereof, the surface of the thermoplastic polyimide layer being surface-treated; a laminate including a polymer film and a layer provided on one or both of the surfaces thereof, the layer including a polyimide resin composition comprising a polyimide resin with a specified structure and a thermosetting component; and a resin film and a laminate including the same which provided one, at least, of surface having a Ra1 value of arithmetic mean roughness of 0.05 μm to 1 μm measured with a cutoff value of 0.002 mm, and a Ra1/Ra2 ratio of 0.4 to 1, Ra2 being a value measured with a cutoff value of 0.1 mm. These laminates can provide a printed circuit board with excellent adhesiveness, on which a micro-wiring circuit can be formed.
摘要翻译： 本发明提供了一种具有包括非热塑性聚酰亚胺膜和设置在其一个或两个表面上的热塑性聚酰亚胺层的双层或三层结构的层压体，热塑性聚酰亚胺层的表面被表面处理; 包括聚合物膜和设置在其一个或两个表面上的层的层压体，所述层包括包含具有特定结构的聚酰亚胺树脂和热固性组分的聚酰亚胺树脂组合物; 以及具有该树脂膜的树脂膜和层叠体，至少具有以0.002mm的截止值测定的算术平均粗糙度的Ra1值为0.05μm〜1μm的表面，Ra1 / Ra2比为0.4的层叠体 至1，Ra2是以0.1mm的截止值测量的值。 这些层压体可以提供具有优异粘附性的印刷电路板，可以在其上形成微结构电路。
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6.发明申请公开(公告)号：US20060115670A1
公开(公告)日：2006-06-01
申请号：US10537959
申请日：2003-12-12
CPC分类号： H05K1/0346 , B32B7/10 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/16 , B32B27/281 , B32B2250/03 , B32B2274/00 , B32B2307/204 , B32B2307/206 , B32B2307/306 , B32B2307/5825 , B32B2307/734 , B32B2457/00 , B32B2457/08 , C23C18/1653 , C23C18/22 , C23C18/26 , C23C18/38 , H05K1/036 , Y10T29/49126 , Y10T29/49155 , Y10T428/12493 , Y10T428/24917 , Y10T428/249991
摘要： The present invention provides a laminate having a two-layer or three-layer structure including a non-thermoplastic polyimide film and a thermoplastic polyimide layer provided on one or both of the surfaces thereof, the surface of the thermoplastic polyimide layer being surface-treated; a laminate including a polymer film and a layer provided on one or both of the surfaces thereof, the layer including a polyimide resin composition comprising a polyimide resin with a specified structure and a thermosetting component; and a resin film and a laminate including the same which provided one, at least, of surface having a Ra1 value of arithmetic mean roughness of 0.05 μm to 1 μm measured with a cutoff value of 0.002 mm, and a Ra1/Ra2 ratio of 0.4 to 1, Ra2 being a value measured with a cutoff value of 0.1 mm. These laminates can provide a printed circuit board with excellent adhesiveness, on which a micro-wiring circuit can be formed.
摘要翻译： 本发明提供了一种具有包括非热塑性聚酰亚胺膜和设置在其一个或两个表面上的热塑性聚酰亚胺层的双层或三层结构的层压体，热塑性聚酰亚胺层的表面被表面处理; 包括聚合物膜和设置在其一个或两个表面上的层的层压体，所述层包括包含具有特定结构的聚酰亚胺树脂和热固性组分的聚酰亚胺树脂组合物; 以及具有该表面的树脂膜和层叠体，至少具有以0.002mm的截止值测定的算术平均粗糙度的Ra1值为0.05μm〜1μm的表面，Ra1 / Ra2的比例为0.4 至1，Ra2是以0.1mm的截止值测量的值。 这些层压体可以提供具有优异粘附性的印刷电路板，可以在其上形成微结构电路。
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7.发明申请Thermosetting resin composition and laminates and circuit board substrates made by using the same 审中-公开热固性树脂组合物和使用它们的层压板和电路板基底公开(公告)号：US20050119381A1
公开(公告)日：2005-06-02
申请号：US10505727
申请日：2003-03-06
CPC分类号： H05K1/0353 , C08G59/4014 , C08L63/00 , C08L79/08 , H05K2201/0154 , C08L2666/20 , C08L2666/22
摘要： A thermosetting resin composition of the present invention includes (A) a polyimide resin, and as thermosetting components, at least one of (B) a multifunctional cynate ester and (C) an epoxy resin. The (A) polyimide resin is soluble polyimide obtained by reacting, with diamines, acid dianhydride including an ether bond. As (B) the multifunctional cynate esters, a compound having a specific structure, and/or an oligomer thereof is used. As (C) the epoxy resin, an epoxy resin having a dicyclopentadiene bone structure and/or an alkoxy-group-including silane denatured epoxy resin (suitable epoxy resin) is preferably used.
摘要翻译： 本发明的热固性树脂组合物包含（A）聚酰亚胺树脂，作为热固性成分，可以使用（B）多官能酯类酯和（C）环氧树脂中的至少一种。 （A）聚酰亚胺树脂是通过与二胺，包括醚键的酸二酐反应获得的可溶性聚酰亚胺。 作为（B）多功能的Cynate酯，使用具有特定结构的化合物和/或其低聚物。 作为（C）环氧树脂，优选使用具有二环戊二烯骨结构的环氧树脂和/或含烷氧基的硅烷变性环氧树脂（适合的环氧树脂）。
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公开(公告)号：US07101619B2
公开(公告)日：2006-09-05
申请号：US11134655
申请日：2005-05-20
CPC分类号： B32B15/08 , B32B27/34 , H05K1/0346 , H05K3/025 , H05K3/146 , H05K3/181 , H05K3/386 , H05K3/4626 , H05K2201/0154 , H05K2201/0195 , Y10T428/24917 , Y10T428/26 , Y10T428/266 , Y10T428/2804 , Y10T428/31678 , Y10T428/31681
摘要： The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 μm. The present invention also relates to a laminate comprising a metal layer having a thickness of at most 5 μm on one or both faces of a synthetic resin film, wherein the synthetic resin film is a polyimide film obtained by immersing a partially imidized or partially dried poly(amide acid) film in a solution of a compound containing at least one element selected from the group consisting of aluminum, silicon, titanium, manganese, iron, cobalt, copper, zinc, tin, antimony, lead, bismuth and palladium or by applying the solution to the film, and then completely drying and imidizing the poly(amide acid) film, the resulting polyimide film containing at least one of the elements.
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