Invention Grant
- Patent Title: System for fabricating liquid crystal display and method of fabricating liquid crystal display using the same
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Application No.: US10184088Application Date: 2002-06-28
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Publication No.: US07102726B2Publication Date: 2006-09-05
- Inventor: Yong Sang Byun , Moo Yeol Park , Sung Su Jung , Sung Chun Kang , Jong Woo Kim , Young Hun Ha , Sang Seok Lee , Sang Ho Park , Hun Jun Choo , Hyug Jin Kweon , Kyung Su Chae , Hae Joon Son , Sang Sun Shin , Jong Go Lim
- Applicant: Yong Sang Byun , Moo Yeol Park , Sung Su Jung , Sung Chun Kang , Jong Woo Kim , Young Hun Ha , Sang Seok Lee , Sang Ho Park , Hun Jun Choo , Hyug Jin Kweon , Kyung Su Chae , Hae Joon Son , Sang Sun Shin , Jong Go Lim
- Applicant Address: KR Seoul
- Assignee: LG. Philips LCD Co., Ltd.
- Current Assignee: LG. Philips LCD Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge LLP
- Priority: KR10-2002-0014202 20020315; KR2002-30204 20020530; KR10-2002-0035384 20020624
- Main IPC: G02F1/1341
- IPC: G02F1/1341

Abstract:
Disclosed is a system for fabricating a liquid crystal display using liquid crystal dropping and a method of fabricating a liquid crystal display using the same. The present invention includes a liquid crystal forming line dropping liquid crystals on the first substrate, a sealant forming line forming the sealant on the second substrate, and a bonding and hardening line bonding the two substrates to each other and hardening the sealant, printing a sealant, bonding the substrates each other, and hardening the sealant and an inspection process line of cutting the bonded substrates into panel units and grinding and inspecting the unit panels. And, the GAP process line includes And, the present invention includes the processes of dropping LC on a first substrate using a dispenser, forming a main UV hardening sealant on a second substrate, bonding the first and second substrates to each other in a vacuum state, UV-hardening the main UV hardening sealant, cutting the bonded substrates into cell units, grinding the cut substrates, and inspecting the grinded substrates finally.
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