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US07103443B2 Directed gas injection apparatus for semiconductor processing 有权
用于半导体加工的定向气体注入装置

Directed gas injection apparatus for semiconductor processing
Abstract:
A method and system for utilizing a gas injection plate comprising a number of shaped orifices (e.g., sonic and simple orifices, and divergent nozzles) in the gas inject system as part of a plasma processing system. By utilizing the shaped orifices, directionality of gas flow can be improved. This improvement is especially beneficial in high aspect ratio processing.
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