发明授权
- 专利标题: Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems
- 专利标题(中): 冷却系统和方法采用多个专用冷却剂调节单元来冷却多个电子子系统
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申请号: US10726347申请日: 2003-12-03
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公开(公告)号: US07106590B2公开(公告)日: 2006-09-12
- 发明人: Richard C. Chu , Michael J. Ellsworth, Jr. , Roger R. Schmidt , Robert E. Simons , Randy J. Zoodsma
- 申请人: Richard C. Chu , Michael J. Ellsworth, Jr. , Roger R. Schmidt , Robert E. Simons , Randy J. Zoodsma
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Heslin Rothenberg Farley & Mesiti, P.C.
- 代理商 Lily Neff, Esq.; Kevin P. Radigan, Esq.
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; F28D15/00
摘要:
A cooling system is provided employing multiple coolant conditioning units (CCUs). Each CCU, which is coupled to a different, associated electronics rack of multiple electronics racks to be cooled, includes a heat exchanger, a first cooling loop with a control valve, and a second cooling loop. The first cooling loop receives chilled facility coolant from a source and passes at least a portion thereof via the control valve through the heat exchanger. The second cooling loop provides cooled system coolant to the associated electronics rack, and expels heat in the heat exchanger from the electronics rack to the chilled facility coolant in the first cooling loop. The control valve allows regulation of the facility coolant flow through the heat exchanger, thereby allowing independent control of temperature of the system coolant in the second cooling loop. Various CCU and associated component redundancies of the cooling system are also provided.
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