公开(公告)号：US09811097B2

公开(公告)日：2017-11-07

申请号：US12425210

申请日：2009-04-16

申请人： Ravi K. Arimilli ,  Michael J. Ellsworth, Jr. ,  Edward J. Seminaro

发明人： Ravi K. Arimilli ,  Michael J. Ellsworth, Jr. ,  Edward J. Seminaro

IPC分类号： G05D23/00 ,  G05D23/19

CPC分类号： G05D23/1931

摘要： A system and computer program product are provided for controlling liquid-cooled electronics, which includes measuring a first set point temperature, Ta, wherein the Ta is based on a dew point temperature, Tdp of a computer room. A second set point temperature, Tb, is measured, wherein the Tb is based on a facility chilled liquid inlet temperature, Tci, and a rack power, Prack, of an electronics rack. A Modular Cooling Unit (MCU) set point temperature, Tsp, is selected. The Tsp is the higher value of said Ta and said Tb. Responsive to the selected Tsp, a control valve is regulated. The control valve controls a flow of liquid that passes through a heat exchanger.

公开(公告)号：US08959941B2

公开(公告)日：2015-02-24

申请号：US13187563

申请日：2011-07-21

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F25D23/12 ,  F28D15/00 ,  H02B1/00 ,  H05K7/20 ,  F28D1/047

CPC分类号： H05K7/20145 ,  F28D1/0477 ,  H05K7/203 ,  H05K7/20318 ,  H05K7/20772 ,  H05K7/20781 ,  H05K7/2079 ,  H05K7/20827 ,  H05K7/20836

摘要： A cooling apparatus and method are provided for cooling an electronics rack. The cooling apparatus includes an air-cooled cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronics rack, and includes a liquid-cooled condenser facilitating immersion-cooling of electronic components of the electronics rack, a liquid-cooled structure providing conductive cooling to electronic components of the electronics rack, or an air-to-liquid heat exchanger associated with the rack and cooling airflow passing through the electronics rack. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger. In operation, heat is transferred via circulating coolant from the electronics rack, and rejected in the liquid-to-air heat exchanger of the cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

公开(公告)号：US08955347B2

公开(公告)日：2015-02-17

申请号：US13187561

申请日：2011-07-21

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F25D23/12 ,  F25D17/02 ,  H05K7/20

CPC分类号： H05K7/20136 ,  H05K7/20209 ,  H05K7/203 ,  H05K7/20745 ,  H05K7/20781

摘要： A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

摘要翻译： 提供一种用于冷却电子机架的电子子系统的冷却装置和方法。 该冷却装置包括一个局部冷却站，该冷却站具有液体 - 空气热交换器和用于引导冷却气流穿过热交换器的管道。 冷却子系统与机架的电子子系统相关联，并且包括促进电子子系统的电子部件的浸入式冷却的壳体，或者向电子子系统的电子部件提供导电冷却的一个或多个液冷结构。 冷却剂回路将冷却子系统连接到本地冷却站的液 - 空热交换器。 在操作中，通过来自电子子系统的循环冷却剂传递热量，并将其在局部冷却站的液体 - 空气热交换器中排出到穿过液体 - 空气热交换器的冷却气流。 在一个实施例中，冷却气流是室外空气。

公开(公告)号：US08955346B2

公开(公告)日：2015-02-17

申请号：US12939546

申请日：2010-11-04

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： F25D23/12 ,  F25B49/02 ,  F25B25/00 ,  H05K7/20

CPC分类号： F25B49/02 ,  F25B25/005 ,  F25B2400/01 ,  F25B2400/06 ,  F25B2500/28 ,  F25B2600/13 ,  F25B2700/21171 ,  H05K7/20809 ,  H05K7/20836 ,  Y02B30/745

摘要： Apparatus and method are provided for cooling an electronic component. The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger coupled in fluid communication with the coolant-cooled structure via a coolant loop to receive coolant from and supply coolant to the coolant-cooled structure. The apparatus further includes a refrigerant loop coupled in fluid communication with the coolant-to-refrigerant heat exchanger, and the heat exchanger cools coolant passing therethrough by dissipating heat from the coolant in the coolant loop to refrigerant in the refrigerant loop. A controllable coolant heater is associated with the coolant loop for providing an adjustable heat load on the coolant in the coolant loop to ensure at least a minimum heat load is dissipated from the coolant to the refrigerant passing through the heat exchanger.

摘要翻译： 提供了用于冷却电子部件的装置和方法。 该装置包括与要冷却的部件热连通的冷却剂冷却结构，以及通过冷却剂回路与冷却剂冷却结构流体连通地连接以冷却和供应的冷却剂与制冷剂热交换器 冷却剂冷却剂冷却结构。 该装置还包括与冷却剂 - 制冷剂热交换器流体连通的制冷剂回路，并且热交换器通过从冷却剂回路中的冷却剂向制冷剂回路中的制冷剂散热而冷却通过其中的冷却剂。 可控制的冷却剂加热器与冷却剂回路相关联，以在冷却剂回路中的冷却剂上提供可调整的热负荷，以确保至少最小的热负荷从冷却剂消耗到通过热交换器的制冷剂。

公开(公告)号：US08867209B2

公开(公告)日：2014-10-21

申请号：US13187556

申请日：2011-07-21

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

IPC分类号： H05K7/20 ,  F28F7/00 ,  F28D15/02 ,  H01L23/473 ,  H01L23/427 ,  H05K13/00 ,  F28D21/00

CPC分类号： H05K13/00 ,  F28D15/02 ,  F28D2021/0028 ,  H01L23/427 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K7/20236 ,  H05K7/203 ,  H05K7/20745 ,  H05K7/20772 ,  H05K7/20809 ,  Y10T29/49002 ,  Y10T29/49353 ,  H01L2924/00

摘要： Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The cooled electronic module includes a substrate supporting the electronic component(s), and the cooling apparatus couples to the substrate, and includes a housing at least partially surrounding and forming a compartment about the electronic component(s). Additionally, the cooling apparatus includes a fluid and a deionization structure disposed within the compartment. The electronic component is at least partially immersed within the fluid, and the fluid is a water-based fluid. The deionization structure includes deionizing material, which ensures deionization of the fluid within the compartment. The deionization structure facilitates boiling heat transfer from the electronic component(s) to a condenser structure disposed in the compartment. Transferred heat is subsequently conducted to, for example, a liquid-cooled cold plate or an air-cooled heat sink coupled to the housing for cooling the condenser structure.

摘要翻译： 提供冷却装置，冷却的电子模块和制造方法用于电子部件的流体浸没冷却。 冷却的电子模块包括支撑电子部件的基板，并且冷却装置耦合到基板，并且包括至少部分围绕电子部件周围并形成隔室的壳体。 此外，冷却装置包括设置在隔室内的流体和去离子结构。 电子部件至少部分地浸没在流体内，并且流体是水基流体。 去离子结构包括去离子材料，其确保隔室内的流体的去离子。 去离子结构便于从电子部件到设置在隔室中的冷凝器结构的沸腾热传递。 随后将转移的热量传送到例如冷却冷凝器结构的液冷冷板或连接到壳体的风冷散热片。

公开(公告)号：US20140069111A1

公开(公告)日：2014-03-13

申请号：US13613832

申请日：2012-09-13

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： F25B21/02 ,  B23P15/26

CPC分类号： B21D53/02 ,  F25B21/02 ,  F25B2321/0252 ,  H05K7/2079 ,  Y10T29/49359

摘要： Thermoelectric-enhanced air and liquid cooling of an electronic system is provided by a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.

摘要翻译： 电子系统的热电增强空气和液体冷却由包括与电子部件热连通的液冷结构的冷却装置提供，液 - 液和空 - 液热交换器 经由冷却剂回路串联流体连通，其包括并联连接的第一和第二回路部分。 液冷结构经由第一回路部分供应冷却剂，热电阵列设置有第一和第二回路部分与阵列的第一和第二侧热接触。 热电阵列用于将热量从穿过第一环路部分的冷却剂传递到穿过第二环路部分的冷却剂，并且在冷却剂通过液冷结构之前冷却通过第一环部分的冷却剂。 通过第一和第二回路部分的冷却剂通过串联耦合的热交换器，其中一个用作散热器。

公开(公告)号：US20130107447A1

公开(公告)日：2013-05-02

申请号：US13285105

申请日：2011-10-31

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： G06F1/20 ,  F28F13/00

CPC分类号： H05K7/20709 ,  H05K7/20781

摘要： A multi-rack assembly is provided which includes adjacent first and second electronics racks, each being at least partially air-cooled, and an air-to-liquid heat exchanger associated with the first rack for cooling at least a portion of air passing through the first rack. The heat exchanger, which is disposed at the air inlet or air outlet side of the first rack and is coupled in fluid communication with a coolant loop to receive coolant from the loop and exhaust coolant to the loop, transfers heat from air passing thereacross to coolant passing therethrough. The assembly also includes a cooling unit, associated with the first rack and cooling coolant in the coolant loop, and an airflow director associated with the second rack and facilitating ducting at least a portion of air passing through the second rack to also pass across the heat exchanger associated with the first rack.

摘要翻译： 提供了一种多机架组件，其包括相邻的第一和第二电子机架，每个电子机架至少部分地是空气冷却的，以及与第一机架相关联的空气与液体热交换器，用于冷却通过 第一个机架。 该热交换器设置在第一齿条的空气入口或空气出口侧，并且与冷却剂回路流体连通地连接以接收来自回路的冷却剂并将冷却剂排出到回路，将来自经过其的空气的热量传递给冷却剂 通过 组件还包括与第一齿条相关联的冷却单元和冷却剂回路中的冷却冷却剂，以及与第二齿条相关联的气流引导件，并且便于管道通过第二齿条的至少一部分空气也穿过热 交换机与第一个机架相关联。

公开(公告)号：US20130105120A1

公开(公告)日：2013-05-02

申请号：US13281945

申请日：2011-10-26

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28D15/02

CPC分类号： H05K7/203 ,  H05K7/20809

摘要： Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s), and a boiling fluid mixture of first and second dielectric fluids within the fluid-tight compartment, with the electronic component(s) immersed within the mixture. A condensing fluid is also provided within the fluid-tight compartment, and is immiscible with the boiling fluid mixture. The condensing fluid has a lower specific gravity and a higher thermal conductivity than the boiling fluid mixture, and facilitates condensing of vaporized boiling fluid mixture. A cooling structure is provided within the compartment, and includes a condensing region and a sub-cooling region, with the condensing region being in contact with the condensing fluid, and the sub-cooling region being in contact with the boiling fluid mixture. The cooling structure facilitates heat removal from the fluid-tight compartment.

摘要翻译： 提供冷却装置和方法用于浸入冷却一个或多个电子部件。 冷却装置包括至少部分围绕电子部件周围并形成流体密封的隔室的壳体，以及流体密封室内的第一和第二介电流体的沸腾流体混合物，其中电子部件 浸在混合物中。 冷凝流体也设置在流体密封室内，并与沸腾的流体混合物不混溶。 冷凝液具有比沸腾流体混合物更低的比重和更高的热导率，并且有助于蒸发的沸腾流体混合物的冷凝。 冷却结构设置在隔室内，并且包括冷凝区域和副冷却区域，其中冷凝区域与冷凝流体接触，并且副冷却区域与沸腾流体混合物接触。 冷却结构便于从流体密封隔室中的热量去除。

公开(公告)号：US20130091867A1

公开(公告)日：2013-04-18

申请号：US13271304

申请日：2011-10-12

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Evan G. COLGAN ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Evan G. COLGAN ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B21/02 ,  B23P15/26

CPC分类号： F25B21/02 ,  B23P15/26 ,  F25B43/00 ,  F25B43/003 ,  F25B2400/01 ,  H05K7/20809 ,  H05K7/20836 ,  Y10T29/49359

摘要： Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter. The separator may further include a refrigerant hot filter coupled to a hot side of the thermoelectric array for further filtering the refrigerant.

摘要翻译： 提供了便于冷却电子部件的装置和方法。 该装置包括蒸气压缩式制冷系统，其包括膨胀部件，蒸发器，压缩机和流体连通的冷凝器。 蒸发器与电子部件联接并冷却。 该装置还包括与制冷剂流动路径流体连通的污染物分离器。 分离器包括制冷剂冷滤器和热电阵列。 通过制冷剂流路的制冷剂的至少一部分通过冷过滤器，并且热电阵列向冷过滤器提供冷却以冷却通过过滤器的制冷剂。 通过冷却通过过滤器的制冷剂，污染物从制冷剂中固化，并沉积在冷过滤器中。 分离器还可以包括耦合到热电阵列的热侧的制冷剂热过滤器，用于进一步过滤制冷剂。

公开(公告)号：US20130091866A1

公开(公告)日：2013-04-18

申请号：US13271275

申请日：2011-10-12

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B21/02

CPC分类号： F25B21/02 ,  F25B2400/17 ,  H01L23/38 ,  H01L23/427 ,  H01L35/30 ,  H01L2924/0002 ,  H05K7/203 ,  H05K7/20809 ,  H01L2924/00

摘要： Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser, heat sink, and thermal conductive path are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the heat sink includes a first region and a second region, with the first region of the heat sink being in thermal contact with the vapor-condenser. The thermal conduction path couples the fluid-tight compartment and the second region of the heat sink in thermal contact, and includes a thermoelectric array, which facilitates transfer of heat from the fluid-tight compartment to the second region of the heat sink through the thermal conduction path.

摘要翻译： 提供冷却装置和方法用于浸入冷却一个或多个电子部件。 冷却装置包括壳体，其至少部分围绕电子部件围绕并形成流体密封的隔室，以及布置在流体密封隔室内的电介质流体，电子部件浸入介电流体内。 还提供蒸汽冷凝器，散热器和导热路径。 蒸汽冷凝器包括在流体密封室内延伸的多个导热冷凝器翅片，并且散热器包括第一区域和第二区域，散热片的第一区域与蒸气冷凝器热接触 。 热传导路径以热接触方式将流体密封室和散热器的第二区域耦合，并且包括热电阵列，其有助于将热量从流体密封隔室传导到散热器的第二区域，通过热 传导路径。