Invention Grant
US07110160B2 Electrical contacts in microelectromechanical devices with multiple substrates 有权
具有多个基板的微机电装置中的电触头

Electrical contacts in microelectromechanical devices with multiple substrates
Abstract:
Disclosed herein a microelectromechanical device having first and second substrates that are bonded together with a gap formed therebetween. A plurality of functional members is disposed within the gap. The two substrates are bonded with a bonding agent that comprises an electrically conductive adhesive material.
Information query
Patent Agency Ranking
0/0