Invention Grant
- Patent Title: Electrical contacts in microelectromechanical devices with multiple substrates
- Patent Title (中): 具有多个基板的微机电装置中的电触头
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Application No.: US11102082Application Date: 2005-04-08
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Publication No.: US07110160B2Publication Date: 2006-09-19
- Inventor: Satyadev Patel , Peter Richards , Jonathan Doan , Terry Tarn
- Applicant: Satyadev Patel , Peter Richards , Jonathan Doan , Terry Tarn
- Applicant Address: US CA Sunnyvale
- Assignee: Reflectivity, INC
- Current Assignee: Reflectivity, INC
- Current Assignee Address: US CA Sunnyvale
- Agent Gregory R. Muir
- Main IPC: G02B26/00
- IPC: G02B26/00 ; G02B26/08
Abstract:
Disclosed herein a microelectromechanical device having first and second substrates that are bonded together with a gap formed therebetween. A plurality of functional members is disposed within the gap. The two substrates are bonded with a bonding agent that comprises an electrically conductive adhesive material.
Public/Granted literature
- US20050275931A1 Electrical contacts in microelectromechanical devices with multiple substrates Public/Granted day:2005-12-15
Information query
