发明授权
- 专利标题: Assembly method for semiconductor die and lead frame
- 专利标题(中): 半导体芯片和引线框架的组装方法
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申请号: US10648654申请日: 2003-08-26
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公开(公告)号: US07112252B2公开(公告)日: 2006-09-26
- 发明人: Larry D. Kinsman , Timothy J. Allen , Jerry M. Brooks
- 申请人: Larry D. Kinsman , Timothy J. Allen , Jerry M. Brooks
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: TraskBritt
- 主分类号: B32B31/12
- IPC分类号: B32B31/12 ; H01R43/00 ; H01R23/495
摘要:
A LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. The lead frame has stress relief slots formed in the undersides of the lead elements proximate the adhesive to accommodate filler particles lodged between the leads and the active surface of the die during transfer molding of a plastic encapsulant. The increased space created by the slots and flexure in the leads about the slots reduces point stresses on the active surface of the die by the filler particles. The increased flexure in the leads about the slots further enhances the locking of the leads in position with respect to the die.
公开/授权文献
- US20040056336A1 Methods for stress reduction feature for LOC lead frame 公开/授权日:2004-03-25