公开(公告)号：US07998792B2

公开(公告)日：2011-08-16

申请号：US12631296

申请日：2009-12-04

申请人： Leonard E. Mess ,  Jerry M. Brooks ,  David J. Corisis

发明人： Leonard E. Mess ,  Jerry M. Brooks ,  David J. Corisis

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06586 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is formed of two or more dice of similar dimensions and bond pad arrangements, in which bond pads are located in fields along less than three edges of the active surface of each die. A first die is attached to a substrate and subsequent die or dice are attached in a vertical sequence atop the first die, each in an offset configuration from the next lower die to expose the bond pads thereof for conductive bonding to metallization of the substrate. The multiple chip device permits a plurality of dice to be stacked in a high-density low-profile device. A particularly useful application is the formation of stacked mass storage flash memory package.

摘要翻译： 半导体器件由两个或更多个具有类似尺寸和接合焊盘布置的管芯形成，其中焊盘位于沿着每个管芯的有效表面的三个边缘的场内。 将第一裸片连接到基底上，随后的裸片或裸片以垂直顺序连接在第一裸片的顶部，每一个都具有与下一个下裸片的偏移配置，以露出其接合焊盘，用于导电粘合以进行衬底的金属化。 多芯片器件允许多个芯片堆叠在高密度薄型器件中。 特别有用的应用是形成堆叠的大容量存储闪存包。

公开(公告)号：US07423336B2

公开(公告)日：2008-09-09

申请号：US10118366

申请日：2002-04-08

申请人： David J. Corisis ,  Jerry M. Brooks ,  Matt E. Schwab ,  Tracy V. Reynolds

发明人： David J. Corisis ,  Jerry M. Brooks ,  Matt E. Schwab ,  Tracy V. Reynolds

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to be used. The conductive elements, which communicate with corresponding conductive vias, reroute the bond pad locations to corresponding contact pad locations adjacent to one peripheral edge or two adjacent peripheral edges of the rerouted semiconductor device. The rerouting element is particularly useful for rerouting centrally located bond pads of a semiconductor device, as well as for rerouting the peripheral locations of bond pads of a semiconductor device to one or two adjacent peripheral edges thereof. Methods for designing and using the rerouting element are also disclosed, as are semiconductor device assemblies including one or more rerouting elements.

摘要翻译： 一种用于半导体器件的重新路由元件，其包括承载导电通孔，导电元件和接触焊盘的电介质膜。 导电通孔位于对应于要使用重新路由元件的半导体器件的接合焊盘的位置的位置处。 与相应的导电通孔连通的导电元件将接合焊盘位置重新路由到与被重新路由的半导体器件的一个外围边缘或两个相邻外围边缘相邻的相应接触焊盘位置。 重新路由元件对于重新布置半导体器件的中心位置的接合焊盘以及将半导体器件的接合焊盘的外围位置重新路由到其一个或两个相邻的外围边缘是特别有用的。 还公开了用于设计和使用重新路由元件的方法，半导体器件组件包括一个或多个重新布线元件。

公开(公告)号：US07282397B2

公开(公告)日：2007-10-16

申请号：US11352685

申请日：2006-02-13

申请人： David J. Corisis ,  Jerry M. Brooks ,  Matt E. Schwab ,  Tracy V. Reynolds

发明人： David J. Corisis ,  Jerry M. Brooks ,  Matt E. Schwab ,  Tracy V. Reynolds

IPC分类号： H01L21/00

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A rerouting element for a semiconductor device includes a substantially planar member that carries at least one contact location, at least one conductive, at least one rerouted bond pad. The contact location is positioned adjacent to a first periphered edge of the substantially planar member and at a location that corresponds to the location of a bond pad of a semiconductor device with which the rerouting element is to be used. The at least one conductive element, which communicates with the at least one contact location, reroutes the bond pad location of the semiconductor device to a corresponding rerouted bond pad location adjacent to a second one peripheral edge of the rerouted substantially planar member which is opposite the first periphered edge. In addition, assemblies including rerouting elements and methods for designing and using rerouting elements are disclosed.

摘要翻译： 用于半导体器件的重新路由元件包括承载至少一个接触位置的基本上平面的构件，至少一个导电的至少一个重新路由的接合焊盘。 接触位置邻近于基本平坦的构件的第一密封边缘并且位于对应于要使用重新路由元件的半导体器件的接合焊盘的位置的位置。 与至少一个接触位置连通的至少一个导电元件将半导体器件的接合焊盘位置重新路由到与重新路由的基本上平面的部件的第二个周边边缘相邻的相应的重路由接合焊盘位置， 第一个边缘。 此外，公开了包括重新路由元件和用于设计和使用重新路由元件的方法的组件。

公开(公告)号：US07232747B2

公开(公告)日：2007-06-19

申请号：US10928512

申请日：2004-08-26

申请人： Warren M. Farnworth ,  Jerry M. Brooks

发明人： Warren M. Farnworth ,  Jerry M. Brooks

IPC分类号： H01L21/44

CPC分类号： H01L24/05 ,  H01L21/288 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/78301 ,  H01L2224/85013 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A method of bumping a wafer for facilitating bonding of bond wires to elevate the bond location above the passivation layer. The wafer is bumped by disposing the wafer in at least one electroless bath having a nickel-containing solution therein, wherein bumps having a nickel-containing material are formed simultaneously on the exposed bond pads to an elevation sufficient to prevent damage to a passivation layer surrounding the bond pads by contact of a wire bonding capillary. A gold or palladium cap may optionally be formed over the nickel-containing material of the bumps. A method of forming a semiconductor device assembly is also disclosed.

摘要翻译： 一种凸起晶片以促进接合线的接合以提高钝化层上方的结合位置的方法。 通过将晶片设置在其中具有含镍溶液的至少一个无电镀浴中来使晶片凸起，其中具有含镍材料的凸块同时形成在暴露的接合焊盘上至足以防止损坏周围钝化层的高度 通过引线键合毛细管接触的接合垫。 可以可选地在凸块的含镍材料上形成金或钯帽。 还公开了一种形成半导体器件组件的方法。

公开(公告)号：US07227261B2

公开(公告)日：2007-06-05

申请号：US10648164

申请日：2003-08-26

申请人： Larry D. Kinsman ,  Jerry M. Brooks ,  Warren M. Farnworth ,  Walter L. Moden ,  Terry R. Lee

发明人： Larry D. Kinsman ,  Jerry M. Brooks ,  Warren M. Farnworth ,  Walter L. Moden ,  Terry R. Lee

IPC分类号： H01L23/34

CPC分类号： H05K3/301 ,  H01L2924/0002 ,  Y10T29/4913 ,  H01L2924/00

摘要： A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has each of its bond pads disposed proximate a single edge thereof. At least a portion of the semiconductor device may be exposed. An alignment device is attached to a carrier substrate. A mounting element on the vertically mountable semiconductor device package engages the alignment device to interconnect the semiconductor device and the alignment device. The alignment device may secure the vertically mountable semiconductor device package perpendicular relative to the carrier substrate. The distance between the bond pads and corresponding terminals on the carrier substrate is very small in order to reduce impedance. The vertically mountable semiconductor device package may also be readily user-upgradable.

摘要翻译： 一种可垂直安装的半导体器件组件，包括半导体器件和用于将半导体器件附着到载体衬底的机构。 半导体器件的每个接合焊盘都设置在其单个边缘附近。 可以暴露半导体器件的至少一部分。 对准装置附接到载体基板。 可垂直安装的半导体器件封装上的安装元件与对准装置接合以使半导体器件和对准器件互连。 对准装置可以使垂直安装的半导体器件封装相对于载体衬底垂直地固定。 接合焊盘和载体基板上的对应端子之间的距离非常小以减少阻抗。 垂直安装的半导体器件封装也可以容易地用户升级。

公开(公告)号：US07094631B2

公开(公告)日：2006-08-22

申请号：US10646420

申请日：2003-08-22

申请人： David J. Corisis ,  Jerry M. Brooks ,  Matt E. Schwab ,  Tracy V. Reynolds

发明人： David J. Corisis ,  Jerry M. Brooks ,  Matt E. Schwab ,  Tracy V. Reynolds

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to be used. The conductive elements, which communicate with corresponding conductive vias, reroute the bond pad locations to corresponding contact pad locations adjacent to one peripheral edge or two adjacent peripheral edges of the rerouted semiconductor device. The rerouting element is particularly useful for rerouting centrally located bond pads of a semiconductor device, as well as for rerouting the peripheral locations of bond pads of a semiconductor device to one or two adjacent peripheral edges thereof. Methods for designing and using the rerouting element are also disclosed, as are semiconductor device assemblies including one or more rerouting elements.

摘要翻译： 一种用于半导体器件的重新路由元件，其包括承载导电通孔，导电元件和接触焊盘的电介质膜。 导电通孔位于对应于要使用重新路由元件的半导体器件的接合焊盘的位置的位置处。 与相应的导电通孔连通的导电元件将接合焊盘位置重新路由到与被重新路由的半导体器件的一个外围边缘或两个相邻外围边缘相邻的相应接触焊盘位置。 重新路由元件对于重新布置半导体器件的中心位置的接合焊盘以及将半导体器件的接合焊盘的外围位置重新路由到其一个或两个相邻的外围边缘是特别有用的。 还公开了用于设计和使用重新路由元件的方法，半导体器件组件包括一个或多个重新布线元件。

公开(公告)号：US07091061B2

公开(公告)日：2006-08-15

申请号：US11092348

申请日：2005-03-29

申请人： Jerrold L. King ,  Jerry M. Brooks

发明人： Jerrold L. King ,  Jerry M. Brooks

IPC分类号： H01L21/44 ,  H01L23/02

CPC分类号： H01L25/0657 ,  H01L25/105 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/00 ,  H01L2224/48

摘要： A stacked assembly of integrated circuit semiconductor devices includes a stack of integrated circuit semiconductor devices supported by a printed circuit board (PCB). One or more multiconductor insulating assemblies provide an interface between terminals of the integrated circuit semiconductor devices and external circuitry.

公开(公告)号：US07038315B2

公开(公告)日：2006-05-02

申请号：US09834696

申请日：2001-04-12

申请人： Jerrold L. King ,  Jerry M. Brooks

发明人： Jerrold L. King ,  Jerry M. Brooks

IPC分类号： H01L23/495 ,  H01L23/52

CPC分类号： H01L23/4952 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49517 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： A semiconductor chip package that includes discrete conductive leads in electrical contact with bond pads on a semiconductor chip. This chip/lead assembly is encapsulated within an encapsulating material and electrode bumps are formed through the encapsulating material to contact the conductive leads. The electrode bumps protrude from the encapsulating material for connection to an external circuit.

摘要翻译： 一种半导体芯片封装，其包括与半导体芯片上的接合焊盘电接触的离散导电引线。 该芯片/引线组件被封装在封装材料内，并且通过封装材料形成电极凸点以接触导电引线。 电极凸块从用于连接到外部电路的封装材料突出。

公开(公告)号：US06902952B2

公开(公告)日：2005-06-07

申请号：US10076849

申请日：2002-02-14

申请人： S. Derek Hinkle ,  Jerry M. Brooks ,  David J. Corisis

发明人： S. Derek Hinkle ,  Jerry M. Brooks ,  David J. Corisis

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L24/06 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49565 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.

摘要翻译： 公开了一种多部件引线框架模具组件，其包括结合到管芯焊盘的管芯。 包括引线的第二引线框架叠加并结合到第一引线框架上。 还公开了一种使用设计用于单引线框处理的设备来制造多部分引线框架组件的方法。 如果需要，多部分引线框架的材料可能是不相似的。

公开(公告)号：US06897096B2

公开(公告)日：2005-05-24

申请号：US10417056

申请日：2003-04-16

申请人： Chad A. Cobbley ,  Jerry M. Brooks

发明人： Chad A. Cobbley ,  Jerry M. Brooks

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L25/065 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/48 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05599 ,  H01L2224/12105 ,  H01L2224/13111 ,  H01L2224/20 ,  H01L2224/32145 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/81801 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2224/82 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method and apparatus for assembling and packaging semiconductor dice. The semiconductor dice or assemblies of stacked and electrically interconnected semiconductor dice are placed at mutually spaced locations with respect to a common plane and encapsulated in a dielectric material so that end portions of discrete conductive elements extending outwardly from each semiconductor die adjacent the common plane are exposed through an outer surface of the dielectric material. Redistribution lines are formed to extend from the exposed end portions of the discrete conductive elements to predetermined locations over the outer surface of the encapsulant which correspond with another interconnect outline and conductive bumps formed at the predetermined locations. Encapsulated semiconductor dice or die stacks may be severed from the encapsulant to form individual packages, or laterally spaced semiconductor dice electrically interconnected by redistribution lines may be maintained together as a group in a single package or module.

摘要翻译： 一种用于组装和封装半导体晶片的方法和装置。 堆叠和电互连的半导体管芯的半导体裸片或组件相对于公共平面放置在相互间隔开的位置并且封装在电介质材料中，使得从邻近公共平面的每个半导体管芯向外延伸的离散导电元件的端部暴露 通过电介质材料的外表面。 再分布线形成为从离散导电元件的暴露的端部延伸到密封剂的外表面上的预定位置，该位置对应于在预定位置处形成的另一互连轮廓和导电凸起。 封装的半导体管芯或管芯堆叠可以从密封剂切断以形成单独的封装，或者通过再分配线电互连的横向间隔开的半导体管芯可以作为一组保持在单个封装或模块中。