发明授权
US07112460B2 Semiconductor laser device, production method therefor, and jig for use in the production method
有权
半导体激光装置及其制造方法以及用于制造方法的夹具
- 专利标题： Semiconductor laser device, production method therefor, and jig for use in the production method
- 专利标题（中）： 半导体激光装置及其制造方法以及用于制造方法的夹具
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申请号： US10731081申请日： 2003-12-08
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公开(公告)号： US07112460B2公开(公告)日： 2006-09-26
- 发明人: Noboru Oshima
- 申请人： Noboru Oshima
- 申请人地址： JP Osaka
- 专利权人： Sharp Kabushiki Kaisha
- 当前专利权人： Sharp Kabushiki Kaisha
- 当前专利权人地址： JP Osaka
- 代理机构： Morrison & Foerster LLP
- 优先权： JP2002-358080 20021210
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A semiconductor laser device includes a semiconductor substrate on which a semiconductor thin film including an active layer is lamineted, a pair of electrodes respectively provided on opposite faces of the substrate, a light emitting surface defined on a side face of the substrate to which the active layer and an edge of at least one of the electrodes are exposed, and a protective film covering the light emitting surface. The protective film has a smaller thickness on the edge of the electrode than on the active layer. This arrangement makes it possible to suppress diffusion of an electrode material in the protective film and sufficiently protect the light emitting surface.
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