Invention Grant
- Patent Title: Methods of forming materials between conductive electrical components, and insulating materials
- Patent Title (中): 在导电电气部件和绝缘材料之间形成材料的方法
-
Application No.: US10330719Application Date: 2002-12-27
-
Publication No.: US07112542B2Publication Date: 2006-09-26
- Inventor: Werner Juengling , Kirk D. Prall , Ravi Iyer , Gurtej S. Sandhu , Guy Blalock
- Applicant: Werner Juengling , Kirk D. Prall , Ravi Iyer , Gurtej S. Sandhu , Guy Blalock
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469 ; H01L21/76

Abstract:
Methods of forming insulating materials between conductive elements include forming a material adjacent a conductive electrical component comprising: partially vaporizing a mass to form a matrix adjacent the conductive electrical component, the matrix having at least one void within it. Other methods include forming a material between a pair of conductive electrical components comprising: forming a pair of conductive electrical components within a mass and separated by an expanse of the mass; forming at least one support member within the expanse of the mass, the support member not comprising a conductive interconnect; and vaporizing the expanse of the mass to a degree effective to form at least one void between the support member and each of the pair of conductive electrical components. Some embodiments include an insulating material adjacent a conductive electrical component, such material comprising a matrix and at least one void within the matrix.
Public/Granted literature
- US20030134503A1 Methods of forming materials between conductive electrical components, and insulating materials Public/Granted day:2003-07-17
Information query
IPC分类: