A system for purging high purity interfaces connecting a high purity chemical container to process lines comprises a first purging manifold, connected at one end to a first adapter manifold extending from the high purity chemical container, and connected at the other end either to a process tool, to a second high purity container, to a source of gas, or to a source of vacuum on one side, or to a source of vent or to a source of vacuum on the other side; and a second purging manifold connecting the second adapter manifold either to a source of push gas, a source of purge gas, or a source of vacuum; or to a source of vent. A related method comprises blowing purge gas through both the first and the second purging manifolds, and, optionally, applying vacuum to both purging manifolds.