发明授权
- 专利标题: Pattern formation method and substrate manufacturing apparatus
- 专利标题(中): 图案形成方法和基板制造装置
-
申请号: US11068303申请日: 2005-02-28
-
公开(公告)号: US07114802B2公开(公告)日: 2006-10-03
- 发明人: Hiroshi Kiguchi , Hitoshi Fukushima , Satoshi Nebashi , Tatsuya Shimoda
- 申请人: Hiroshi Kiguchi , Hitoshi Fukushima , Satoshi Nebashi , Tatsuya Shimoda
- 申请人地址: JP
- 专利权人: Seiko Epson Corporation
- 当前专利权人: Seiko Epson Corporation
- 当前专利权人地址: JP
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: JP10-008016 19980119
- 主分类号: B41J2/01
- IPC分类号: B41J2/01
摘要:
A pattern formation method for discharging a prescribed fluid onto a substrate form an ink-jet head and forming an arbitrary pattern. The method including the steps of discharging the fluid onto the substrate from an ink jet head and defining a pattern-forming region by subjecting the substrate to a specific treatment to prevent the fluid from spreading. The pattern forming region is formed after the fluid has been ejected so that the arbitrary pattern is formed in the fluid corresponding to the pattern-forming region. The treatment is one in which banks for preventing the fluid from flowing out are formed around the pattern-forming region. The method also includes removing the banks following the formation of the pattern.
公开/授权文献
信息查询
IPC分类: