发明授权
- 专利标题: Land grid array with socket plate
- 专利标题(中): 带有插座板的土地格栅阵列
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申请号: US10925451申请日: 2004-08-25
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公开(公告)号: US07114959B2公开(公告)日: 2006-10-03
- 发明人: Brent S. Stone , Joel A. Auernheimer
- 申请人: Brent S. Stone , Joel A. Auernheimer
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Trop, Pruner & Hu, P.C.
- 主分类号: H01R12/00
- IPC分类号: H01R12/00 ; H05K1/00
摘要:
A grounded conductive plate in a land grid array package assembly includes a plurality of openings. The openings allow contacts from the socket to pass through to contact a package. The diameter of each opening is customizable to produce desired impedance between the contacts and the conductive plate. Impedance discontinuity seen by signals passing through the socket may be reduced.
公开/授权文献
- US20060046527A1 Land grid array with socket plate 公开/授权日:2006-03-02