发明授权
US07115431B2 Method of fabricating reflective liquid crystal display integrated with driving circuit 有权
制造与驱动电路集成的反射型液晶显示器的方法

  • 专利标题: Method of fabricating reflective liquid crystal display integrated with driving circuit
  • 专利标题(中): 制造与驱动电路集成的反射型液晶显示器的方法
  • 申请号: US10409453
    申请日: 2003-04-09
  • 公开(公告)号: US07115431B2
    公开(公告)日: 2006-10-03
  • 发明人: Hsin-Ming Chen
  • 申请人: Hsin-Ming Chen
  • 申请人地址: TW Chu-Nan
  • 专利权人: TPO Displays Corp.
  • 当前专利权人: TPO Displays Corp.
  • 当前专利权人地址: TW Chu-Nan
  • 代理机构: Liu & Liu
  • 优先权: TW91124415A 20021022
  • 主分类号: H01L21/84
  • IPC分类号: H01L21/84
Method of fabricating reflective liquid crystal display integrated with driving circuit
摘要:
A method of forming a liquid crystal display device with a pixel TFT, a bottom electrode of pixel capacitor CL, and a storage capacitor Cs in a pixel region, and an n-type TFT and a p-type TFT in a driving circuit region is disclosed. Firstly, a metal layer and an n-type silicon layer are formed on a transparent substrate. Thereafter, a patterning step is performed to define some predefined regions for above devices. After an active layer and a gate oxide layer are formed in order on all patterned surfaces, another patterning step is done to form a first, a second, and a third preserved region, respectively, for a LDD region of the n type TFT, source/drain regions for the p type TFT and a LDD region for pixel TFT and Cs. Thereafter, a photosensitive layer is deposited and patterned to form a reflective bumps region. A metal layer is formed and patterned to form a cover over the reflective bumps region and gate electrodes for aforementioned TFT as well as an upper electrode for Cs. Subsequently, a blanket nLDD implant is performed. Thereafter, a p type source/drain implant is carried out using a photoresist pattern as a mask. After removing the photoresist pattern, a passivation layer is formed on all areas. Next an annealing is performed to active the implant impurities. Another patterning process is then performed to expose the metal reflective layer over the bumps region and to form contact by patterning the passivation layer.
信息查询
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L21/00 专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70 .由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理;集成电路器件或其特殊部件的制造(由预制电组件组成的组装件的制造入H05K3/00,H05K13/00)
H01L21/77 ..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理(电可编程只读存储器或其多步骤的制造方法入H01L27/115)
H01L21/78 ...把衬底连续地分成多个独立的器件(改变表面物理特性或者半导体形状的切割入H01L21/304)
H01L21/82 ....制造器件,例如每一个由许多元件组成的集成电路
H01L21/84 .....衬底不是半导体的,例如绝缘体
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