- 专利标题: Method of manufacturing semiconductor device
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申请号: US10919513申请日: 2004-08-17
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公开(公告)号: US07115488B2公开(公告)日: 2006-10-03
- 发明人: Atsuo Isobe , Satoru Saito , Saishi Fujikawa
- 申请人: Atsuo Isobe , Satoru Saito , Saishi Fujikawa
- 申请人地址: JP
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP
- 代理机构: Fish & Richardson P.C.
- 优先权: JP2003-307489 20030829
- 主分类号: H01L21/20
- IPC分类号: H01L21/20
摘要:
Since sodium contained in glass, or glass itself has low heat resistance; a CPU fabricated using a TFT formed over a glass substrate or the like has not been obtained. In the case of operating a CPU with high-speed, the length of a gate (gate length) of a TFT is required to be shorter. However, since a glass substrate has large deflection, a gate electrode cannot have been etched to have a gate length short enough to be used for a CPU. According to the invention, a conductive film is formed over a crystalline semiconductor film formed over a glass substrate, a mask is formed over the conductive film, and the conductive film is etched by using the mask; thus, a thin film transistor with a gate length of 1.0 μm or less is formed. In particular, the crystalline semiconductor film is formed by crystallizing an amorphous semiconductor film formed over a glass substrate by laser irradiation.
公开/授权文献
- US20050048744A1 Method of manufacturing semiconductor device 公开/授权日:2005-03-03
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