Invention Grant
- Patent Title: Method of applying micro-protection in defect analysis
- Patent Title (中): 在缺陷分析中应用微保护的方法
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Application No.: US10908953Application Date: 2005-06-01
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Publication No.: US07115865B2Publication Date: 2006-10-03
- Inventor: Ching-Pin Chang , Ching-Ching Shih , Ting-Wei Chen
- Applicant: Ching-Pin Chang , Ching-Ching Shih , Ting-Wei Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Powerchip Semiconductor Corp.
- Current Assignee: Powerchip Semiconductor Corp.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW93140357A 20041223
- Main IPC: H01J37/256
- IPC: H01J37/256
Abstract:
The present invention discloses a method of applying micro-protection in defect analysis. The method includes providing a substrate having at least one defect thereon, forming the micro-protection on the surface of the defect, confirming the site of the defect, and forming a specimen of the defect by utilizing a focused ion beam microscope.
Public/Granted literature
- US20060138323A1 Method of Applying Micro-Protection in Defect Analysis Public/Granted day:2006-06-29
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