发明授权
- 专利标题: Method of closing an antifuse using laser energy
- 专利标题(中): 使用激光能量封闭反熔丝的方法
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申请号: US10971238申请日: 2004-10-22
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公开(公告)号: US07115968B2公开(公告)日: 2006-10-03
- 发明人: William T. Motsiff , William R. Tonti , Richard Q. Williams
- 申请人: William T. Motsiff , William R. Tonti , Richard Q. Williams
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: RatnerPrestia
- 主分类号: H01L29/00
- IPC分类号: H01L29/00
摘要:
A structure and method for providing an antifuse which is closed by laser energy with an electrostatic assist. Two or more metal segments are formed over a semiconductor structure with an air gap or a porous dielectric between the metal segments. Pulsed laser energy is applied to one or more of the metal segments while a voltage potential is applied between the metal segments to create an electrostatic field. The pulsed laser energy softens the metal segment, and the electrostatic field causes the metal segments to move into contact with each other. The electrostatic field reduces the amount of laser energy which must be applied to the semiconductor structure to close the antifuse.
公开/授权文献
- US20050051868A1 Method of closing an antifuse 公开/授权日:2005-03-10