发明授权
- 专利标题： Flip-chip light emitting diode
- 专利标题（中）： 倒装芯片发光二极管
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申请号： US10693126申请日： 2003-10-24
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公开(公告)号： US07119372B2公开(公告)日： 2006-10-10
- 发明人: Edward B. Stokes , Mark P. D'Evelyn , Stanton E. Weaver , Peter M. Sandvik , Abasifreke U. Ebong , Xian-an Cao , Steven F. LeBoeuf , Nikhil R. Taskar
- 申请人： Edward B. Stokes , Mark P. D'Evelyn , Stanton E. Weaver , Peter M. Sandvik , Abasifreke U. Ebong , Xian-an Cao , Steven F. LeBoeuf , Nikhil R. Taskar
- 申请人地址： US OH Valley View
- 专利权人： GELcore, LLC
- 当前专利权人： GELcore, LLC
- 当前专利权人地址： US OH Valley View
- 代理机构： Fay, Sharpe, Fagan, Minnich & McKee, LLP
- 主分类号： H01L27/15
- IPC分类号： H01L27/15
摘要：
A flip chip light emitting diode die (10, 10′, 10″) includes a light-transmissive substrate (12, 12′, 12″) and semiconductor layers (14, 14′, 14″) that are selectively patterned to define a device mesa (30, 30′, 30″). A reflective electrode (34, 34′, 34″) is disposed on the device mesa (30, 30′, 30″). The reflective electrode (34, 34′, 34″) includes a light-transmissive insulating grid (42, 42′, 60, 80) disposed over the device mesa (30, 30′, 30″), an ohmic material (44, 44′, 44″, 62) disposed at openings of the insulating grid (42, 42′, 60, 80) and making ohmic contact with the device mesa (30, 30′, 30″), and an electrically conductive reflective film (46, 46′, 46″) disposed over the insulating grid (42, 42′, 60, 80) and the ohmic material (44, 44′, 44″, 62). The electrically conductive reflective film (46, 46′, 46″) electrically communicates with the ohmic material (44, 44′, 44″, 62).
公开/授权文献
- US20050087884A1 Flip-chip light emitting diode 公开/授权日：2005-04-28