A processor extraction device interacts with a processor to extract the processor from coupling between connectors of the processor and a socket, such as land grid array connectors that are susceptible to damage from dragging or rotational movement during extraction. For instance, adhesive couples the processor to a load plate that closes over the socket to compress the processor in the socket so that the adhesive extracts the processor as the load plate moves from the closed position to an open position distal the socket. As another example, the load plate closed position compresses the processor onto springs that bias the processor out of the socket upon movement of the load plate to the opened position.