Invention Grant
US07125199B2 Elastic permeable pavement comprising waste-polyurethane chips for use on new roads and a paving method using the same 有权
包括用于新道路的废聚氨酯芯片的弹性渗透路面和使用其的铺路方法

  • Patent Title: Elastic permeable pavement comprising waste-polyurethane chips for use on new roads and a paving method using the same
  • Patent Title (中): 包括用于新道路的废聚氨酯芯片的弹性渗透路面和使用其的铺路方法
  • Application No.: US10805563
    Application Date: 2004-03-19
  • Publication No.: US07125199B2
    Publication Date: 2006-10-24
  • Inventor: Sung Soon Kang
  • Applicant: Sung Soon Kang
  • Agency: Madson & Austin
  • Priority: KR10-2004-0007860 20040206
  • Main IPC: E01C7/30
  • IPC: E01C7/30 E01C15/00
Elastic permeable pavement comprising waste-polyurethane chips for use on new roads and a paving method using the same
Abstract:
An elastic permeable pavement comprising waste-polyurethane chips for use on new roads and a paving method using the same. This pavement uses a binder specially developed to secure the binding between an upper polyurethane chip layer and a lower permeable concrete layer as well as the binding among the waste-polyurethane chips, resulting in excellent strength and durability, and uses recycled polyurethane chips to provide elasticity and permeability suitable for sports activities, walking, and outdoor exercises.
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