发明授权
US07126230B2 Semiconductor electronic device and method of manufacturing thereof 有权
半导体电子器件及其制造方法

Semiconductor electronic device and method of manufacturing thereof
摘要:
A semiconductor electronic device is described comprising a die of semiconductor material having a plurality of contact pads electrically connected to a support for example through interposition of contact wires, said plurality of contact pads comprising signal pads and power pads, the device being characterized in that said signal pads are implemented on the die of semiconductor material with a mutual pitch lower than the pitch between said power pads.
信息查询
0/0