Invention Grant
- Patent Title: Protective tape removing apparatus and method of assembling semiconductor package using the same
- Patent Title (中): 保护胶带去除装置及其组装方法
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Application No.: US10621576Application Date: 2003-07-18
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Publication No.: US07129118B2Publication Date: 2006-10-31
- Inventor: Cheol-Joon Yoo , Ki-Kwon Jeong
- Applicant: Cheol-Joon Yoo , Ki-Kwon Jeong
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2002-0082672 20021223
- Main IPC: H01L21/58
- IPC: H01L21/58 ; B23P19/00
Abstract:
A method of utilizing a removable protective tape to protect the active surfaces of semiconductor wafer and the individual semiconductor chips during semiconductor packaging processes is provided along with several configurations of apparatuses that may be used in such a method for removing protective tape portions from individual semiconductor chips during the assembly process.
Public/Granted literature
- US20040121514A1 Protective tape removing apparatus and method of assembling semiconductor package using the same Public/Granted day:2004-06-24
Information query
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