发明授权
- 专利标题： Method for simultaneously removing multiple conductive materials from microelectronic substrates
- 专利标题（中）： 从微电子基板同时去除多个导电材料的方法
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申请号： US10230602申请日： 2002-08-29
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公开(公告)号： US07129160B2公开(公告)日： 2006-10-31
- 发明人: Dinesh Chopra
- 申请人： Dinesh Chopra
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： Perkins Coie LLP
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763
摘要：
A method and apparatus for simultaneously removing conductive materials from a microelectronic substrate. A method in accordance with one embodiment of the invention includes contacting a surface of a microelectronic substrate with an electrolytic liquid, the microelectronic substrate having first and second different conductive materials. The method can further include controlling a difference between a first open circuit potential of the first conducive material and a second open circuit potential of the second conductive material by selecting a pH of the electrolytic liquid. The method can further include simultaneously removing at least portions of the first and second conductive materials by passing a varying electrical signal through the electrolytic liquid and the conductive materials. Accordingly, the effects of galvanic interactions between the two conductive materials can be reduced and/or eliminated.
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