Invention Grant
US07129572B2 Submember mounted on a chip of electrical device for electrical connection
有权
子元件安装在用于电连接的电气设备的芯片上
- Patent Title: Submember mounted on a chip of electrical device for electrical connection
- Patent Title (中): 子元件安装在用于电连接的电气设备的芯片上
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Application No.: US11199273Application Date: 2005-08-09
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Publication No.: US07129572B2Publication Date: 2006-10-31
- Inventor: Chung-Cheng Wang
- Applicant: Chung-Cheng Wang
- Agency: Bacon & Thomas, PLLC
- Priority: TW93124883A 20040818; TW93135164A 20041117
- Main IPC: H01L23/02
- IPC: H01L23/02

Abstract:
A submember for electrical device is disclosed. Said submember is mounted on a chip of electrical device. An embodiment for the submember comprised of an insulator and a plurality of conductive elements, wherein the conductive elements embedded in the insulator and a portion of conductive element exposed to the insulator for electrical connection, then (i). the reliability of submember is enhanced; (ii). the material of insulator enables to be saved; and (iii). the thickness of submember is thinner and the heat dissipation of chip enhanced; moreover, a portion of the conductive element may be protruding the insulator for avoiding a short-circuited problem of conductive wire, moreover, the conductive element may be staircase-shaped, then, not only the reliability of submember is enhanced, but the short circuit problem of conductive wire is also avoided; the conductive element may further include an extending portion, furthermore, the conductive element may be placed in a cavity as required.
Public/Granted literature
- US20060038278A1 Submember mounted on a chip of electrical device for electrical connection Public/Granted day:2006-02-23
Information query
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