Invention Grant
US07129576B2 Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps
有权
制造包覆芯片的结构和方法，包括垂直互连，其具有与所述盖的表面接合的柱形凸块
- Patent Title: Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps
- Patent Title (中): 制造包覆芯片的结构和方法，包括垂直互连，其具有与所述盖的表面接合的柱形凸块
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Application No.: US10949693Application Date: 2004-09-24
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Publication No.: US07129576B2Publication Date: 2006-10-31
- Inventor: Giles Humpston
- Applicant: Giles Humpston
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner,David,Littenberg,Krumholz & Mentlik, LLP
- Main IPC: H01L23/12
- IPC: H01L23/12
Abstract:
A capped chip is provided which includes a chip and a cap member, the chip having a front surface and a plurality of bond pads exposed at the front surface, the cap member having a bottom surface facing the front surface of the chip and having a top surface opposite the front surface. A plurality of through holes extend from the bottom surface of the cap member to the top surface. The capped chip assembly further includes a plurality of metallic interconnects extending from the bond pads at least partially through the through holes, the metallic interconnects including stud bumps joined to the bond pads, the stud bumps contacting and engaging at least one of (i) the top surface of the cap member surrounding the through holes and (ii) inner surfaces of the through holes.
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