发明授权
- 专利标题： Method of forming a fluid ejection device with a compressive alpha-tantalum layer
- 专利标题（中）： 用压缩α-钽层形成流体喷射装置的方法
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申请号： US11065933申请日： 2005-02-25
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公开(公告)号： US07132132B2公开(公告)日： 2006-11-07
- 发明人: Arjang Fartash
- 申请人： Arjang Fartash
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： B05D5/12
- IPC分类号： B05D5/12
摘要：
A method of forming a fluid ejection device is disclosed. The steps of forming the fluid ejection device may include forming a heating element on a substrate. The steps for forming the fluid ejection device may further include depositing a buffer layer over the heating element, and depositing a layer of compressive alpha-tantalum on the buffer layer with lattice matching between the layer of compressive alpha-tantalum and the buffer layer.
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