发明授权
- 专利标题： Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and SAW device
- 专利标题（中）： 包装基板及其制造方法，集成电路装置及其制造方法以及SAW器件
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申请号： US11333316申请日： 2006-01-18
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公开(公告)号： US07132310B2公开(公告)日： 2006-11-07
- 发明人: Masahiro Nakano , Katsuhiko Gunji , Yasunobu Oikawa , Katsuo Sato
- 申请人： Masahiro Nakano , Katsuhiko Gunji , Yasunobu Oikawa , Katsuo Sato
- 申请人地址： JP Tokyo
- 专利权人： TDK Corporation
- 当前专利权人： TDK Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： McGinn IP Law Group PLLC
- 优先权： JP2001-352449 20011116; JP2001-352451 20011116; JP2001-352452 20011116; JP2001-353195 20011119
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
A basic portion layer 21 of a substrate electrode 12a connected to a projecting electrode 13 electrically and mechanically on a substrate member of ceramics. The substrate member on which the basic portion layer 21 is formed is subjected to sintering. A surface of the basic portion layer 21 in the sintered substrate member is polished. On the polished basic portion layer 21, the plating layers 22, 23are formed, so that surface roughness of the substrate electrode 12a may be, for example, not larger than 0.1 μmRMS. Accordingly, junction strength of an integrated circuit element mounted on a packaging substrate by a flip-chip method can be improved.
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