发明授权
- 专利标题： Polishing method
- 专利标题（中）： 抛光方法
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申请号： US10441063申请日： 2003-05-20
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公开(公告)号： US07132367B2公开(公告)日： 2006-11-07
- 发明人: Seiichi Kondo , Yoshio Homma , Noriyuki Sakuma , Kenichi Takeda , Kenji Hinode
- 申请人： Seiichi Kondo , Yoshio Homma , Noriyuki Sakuma , Kenichi Takeda , Kenji Hinode
- 申请人地址： JP Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout and Kraus, LLP.
- 优先权： JP9-299937 19971031
- 主分类号： H01L21/302
- IPC分类号： H01L21/302
摘要：
A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced A metal film formed on an insulating film comprising a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.
公开/授权文献
- US20050074967A1 Polishing method 公开/授权日：2005-04-07
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