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    Polishing method
    1.
    发明授权
    Polishing method 有权
    抛光方法

    公开(公告)号：US07132367B2

    公开(公告)日：2006-11-07

    申请号：US10441063

    申请日：2003-05-20

    申请人： Seiichi Kondo ,  Yoshio Homma ,  Noriyuki Sakuma ,  Kenichi Takeda ,  Kenji Hinode

    发明人： Seiichi Kondo ,  Yoshio Homma ,  Noriyuki Sakuma ,  Kenichi Takeda ,  Kenji Hinode

    IPC分类号： H01L21/302

    CPC分类号： C23F3/06 ,  B24B37/04 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/7684

    摘要： A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced A metal film formed on an insulating film comprising a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.

    摘要翻译： 抑制了划痕，剥离，凹陷和侵蚀的抛光技术，不需要复杂的清洁处理和浆料供应/处理设备，并且消耗品如浆料和抛光垫的成本降低。在绝缘膜上形成的金属膜 包括用包含氧化剂的抛光溶液和使氧化物水溶性但不含抛光磨料的物质抛光的凹槽。

    Polishing method
    2.
    发明授权
    Polishing method 有权
    抛光方法

    公开(公告)号：US06596638B1

    公开(公告)日：2003-07-22

    申请号：US09618999

    申请日：2000-07-18

    申请人： Seiichi Kondo ,  Yoshio Homma ,  Noriyuki Sakuma ,  Kenichi Takeda ,  Kenji Hinode

    发明人： Seiichi Kondo ,  Yoshio Homma ,  Noriyuki Sakuma ,  Kenichi Takeda ,  Kenji Hinode

    IPC分类号： H01L21302

    CPC分类号： C23F3/06 ,  B24B37/04 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/7684

    摘要： A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items, such as slurries and polishing pads, is reduced. A metal film formed on an insulating film having a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.

    摘要翻译： 抑制了划痕，剥离，凹陷和侵蚀的抛光技术，不需要复杂的清洁处理和浆料供应/处理设备，并且消耗品如浆料和抛光垫的成本降低。 在具有凹槽的绝缘膜上形成的金属膜用含有氧化剂和使氧化物水溶性但不含抛光磨料的物质的抛光溶液抛光。

    Polishing method
    3.
    发明授权
    Polishing method 有权
    抛光方法

    公开(公告)号：US07563716B2

    公开(公告)日：2009-07-21

    申请号：US11693383

    申请日：2007-03-29

    申请人： Seiichi Kondo ,  Yoshio Homma ,  Noriyuki Sakuma ,  Kenichi Takeda ,  Kenji Hinode

    发明人： Seiichi Kondo ,  Yoshio Homma ,  Noriyuki Sakuma ,  Kenichi Takeda ,  Kenji Hinode

    IPC分类号： H01L21/302

    CPC分类号： C23F3/06 ,  B24B37/04 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/7684

    摘要： A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced. A metal film formed on an insulating film comprising a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.

    摘要翻译： 抑制了划痕，剥离，凹陷和侵蚀的抛光技术，不需要复杂的清洁工艺和浆料供应/加工设备，并且消耗品如浆料和抛光垫的成本降低。 在包含凹槽的绝缘膜上形成的金属膜用含有氧化剂和使氧化物溶于水但不含抛光磨料的物质的抛光溶液抛光。

    Polishing method
    6.
    发明授权
    Polishing method 有权
    抛光方法

    公开(公告)号：US07279425B2

    公开(公告)日：2007-10-09

    申请号：US11581375

    申请日：2006-10-17

    申请人： Seiichi Kondo ,  Yoshio Homma ,  Noriyuki Sakuma ,  Kenichi Takeda ,  Kenji Hinode

    发明人： Seiichi Kondo ,  Yoshio Homma ,  Noriyuki Sakuma ,  Kenichi Takeda ,  Kenji Hinode

    IPC分类号： H01L21/302

    CPC分类号： C23F3/06 ,  B24B37/04 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/7684

    摘要： A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced. A metal film formed on an insulating film comprising a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.

    摘要翻译： 抑制了划痕，剥离，凹陷和侵蚀的抛光技术，不需要复杂的清洁工艺和浆料供应/加工设备，并且消耗品如浆料和抛光垫的成本降低。 在包含凹槽的绝缘膜上形成的金属膜用含有氧化剂和使氧化物溶于水但不含抛光磨料的物质的抛光溶液抛光。

    Process for manufacturing semiconductor integrated circuit device
    10.
    发明授权
    Process for manufacturing semiconductor integrated circuit device 有权
    半导体集成电路器件制造工艺

    公开(公告)号：US08129275B2

    公开(公告)日：2012-03-06

    申请号：US12700784

    申请日：2010-02-05

    申请人： Naofumi Ohashi ,  Junji Noguchi ,  Toshinori Imai ,  Hizuru Yamaguchi ,  Nobuo Owada ,  Kenji Hinode ,  Yoshio Homma ,  Seiichi Kondo

    发明人： Naofumi Ohashi ,  Junji Noguchi ,  Toshinori Imai ,  Hizuru Yamaguchi ,  Nobuo Owada ,  Kenji Hinode ,  Yoshio Homma ,  Seiichi Kondo

    IPC分类号： H01L21/44

    CPC分类号： H01L21/0209 ,  G09G5/399 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/76838 ,  H01L21/7684 ,  Y10S438/906

    摘要： In order to provide an anticorrosive technique for metal wirings formed by a chemical mechanical polishing (CMP) method, a process for manufacturing a semiconductor integrated circuit device according to the invention comprises the steps of: forming a metal layer of Cu (or a Cu alloy containing Cu as a main component) over the major face of a wafer and then planarizing the metal layer by a chemical mechanical polishing (CMP) method to form metal wirings; anticorroding the planarized major face of the wafer to form a hydrophobic protective film over the surfaces of the metal wirings; immersing the anticorroded major face of the wafer or keeping the same in a wet state so that it may not become dry; and post-cleaning the major face, kept in the wet state, of the wafer.

    摘要翻译： 为了提供通过化学机械抛光（CMP）方法形成的金属配线的防腐蚀技术，根据本发明的半导体集成电路器件的制造方法包括以下步骤：形成Cu（或Cu合金）的金属层 含有Cu作为主要成分），然后通过化学机械抛光（CMP）方法平坦化金属层以形成金属布线; 防止晶片的平面化主面在金属布线的表面上形成疏水性保护膜; 将晶圆的防腐主面浸入或保持湿润状态，使其不会变干; 并将晶片的主要表面保持在潮湿状态。