发明授权
- 专利标题: Laser machining apparatus and laser machining method
- 专利标题(中): 激光加工设备和激光加工方法
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申请号: US10921224申请日: 2004-08-19
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公开(公告)号: US07132622B2公开(公告)日: 2006-11-07
- 发明人: Yasushi Ito , Futao Naruse , Osamu Maruyama
- 申请人: Yasushi Ito , Futao Naruse , Osamu Maruyama
- 申请人地址: JP Kanagawa-ken
- 专利权人: Hitachi Via Mechanics, Ltd.
- 当前专利权人: Hitachi Via Mechanics, Ltd.
- 当前专利权人地址: JP Kanagawa-ken
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2003-208535 20030825; JP2004-077065 20040317; JP2004-117328 20040412
- 主分类号: B23K26/00
- IPC分类号: B23K26/00
摘要:
There is provided a laser machining apparatus, and a laser machining method using the same. The laser machining apparatus has a body portion having a plurality of laser irradiating sections and work mounting sections, a supplying stocker for supplying workpieces, and a discharging stocker for discharging the workpieces. The apparatus further comprises a supply-side transfer unit having work retaining tables capable of attracting/releasing the workpieces and being of the same number as the laser irradiating sections, and moving in vertical and horizontal directions, and a discharge-side transfer unit having work retaining tables capable of attracting/releasing the workpieces and being of the same number as the laser irradiating sections, and moving in vertical and horizontal directions. The supply-side transfer unit causes the supply-side work retaining tables to attract the workpieces from the supplying stocker one after another and moves these supply-side work retaining tables to the work mounting sections to place the workpieces thereon. The discharge-side transfer unit causes the discharge-side work retaining tables to attract the work pieces which have been machined at work mounting sections, and to move and discharge these workpieces to the discharging stocker.
公开/授权文献
- US20050045606A1 Laser machining apparatus and laser machining method 公开/授权日:2005-03-03
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