发明授权
- 专利标题: Cooling structure and cooling method for electronic equipment
- 专利标题(中): 电子设备冷却结构及冷却方式
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申请号: US11034138申请日: 2005-01-12
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公开(公告)号: US07134607B2公开(公告)日: 2006-11-14
- 发明人: Fujio Ozawa , Junichi Hayama , Tetsuya Murayama , Hiroyuki Abe , Naoya Yamazaki
- 申请人: Fujio Ozawa , Junichi Hayama , Tetsuya Murayama , Hiroyuki Abe , Naoya Yamazaki
- 申请人地址: JP Kawasaki
- 专利权人: Fujitsu Limited
- 当前专利权人: Fujitsu Limited
- 当前专利权人地址: JP Kawasaki
- 代理机构: Katten Muchin Rosenman LLP
- 主分类号: F24F7/00
- IPC分类号: F24F7/00 ; F25D23/12 ; H05K7/20
摘要:
A cooling structure for electronic equipment including a plurality of electronic devices superposed on each other, each of the electronic devices having a lower part where an air ventilation part configured to ventilate air so as to cool the electronic device is provided, the cooling structure includes an air intake and exhaust hole forming part which is formed at an upper part of a first one of the electronic devices and below the air ventilation part of a second one of the electronic devices provided on the first electronic device. Air outside of the electronic equipment is taken into an inside of the second electronic device or air inside of the first electronic device is exhausted to the outside of the electronic equipment via the air intake and exhaust hole forming part, so that an amount of the air ventilated inside of the first electronic device is controlled.