发明授权
- 专利标题： Method of manufacturing a wiring board
- 专利标题（中）： 制造布线板的方法
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申请号： US10758698申请日： 2004-01-15
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公开(公告)号： US07135204B2公开(公告)日： 2006-11-14
- 发明人: Fumiaki Karasawa
- 申请人： Fumiaki Karasawa
- 申请人地址： JP
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JP
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： JP2003-008462 20030116
- 主分类号： B05D5/12
- IPC分类号： B05D5/12
摘要：
A method of manufacturing a wiring board is provided. The method includes performing a plating process to a land, in a condition that a resist film having an opening for exposing at least the center of the land is formed on a substrate with wires having the land formed thereon, so that a fist portion of an edge of the opening is disposed on the substrate and a second portion of the edge is disposed on the land.
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