Invention Grant
US07135357B2 Process for making an organic electronic device having a roughened surface heat sink
有权
制造具有粗糙表面散热器的有机电子器件的方法
- Patent Title: Process for making an organic electronic device having a roughened surface heat sink
- Patent Title (中): 制造具有粗糙表面散热器的有机电子器件的方法
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Application No.: US10683828Application Date: 2003-10-10
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Publication No.: US07135357B2Publication Date: 2006-11-14
- Inventor: Gang Yu , Jian Wang
- Applicant: Gang Yu , Jian Wang
- Applicant Address: US DE Wilmington
- Assignee: E. I. du Pont de Nemours and Company
- Current Assignee: E. I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Agent John H. Lamming
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
An aspect of the present invention provides an organic electronic device includes a heat sink having a side with a roughened surface and/or a black surface and a process for forming devices having such heat sinks including forming a patterned electrically conductive layer includes an electrically conductive member. The process includes selectively forming spaced-apart members. The heat sink includes the spaced-apart members, which are spaced apart from each other and thermally coupled to the electrically conductive member.
Public/Granted literature
- US20050077601A1 Organic electronic devices with low thermal resistance and processes for forming and using the same Public/Granted day:2005-04-14
Information query
IPC分类:
