发明授权
US07137354B2 Plasma immersion ion implantation apparatus including a plasma source having low dissociation and low minimum plasma voltage
失效
等离子体浸入式离子注入装置,其包括具有低离解性和低最小等离子体电压的等离子体源
- 专利标题: Plasma immersion ion implantation apparatus including a plasma source having low dissociation and low minimum plasma voltage
- 专利标题(中): 等离子体浸入式离子注入装置,其包括具有低离解性和低最小等离子体电压的等离子体源
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申请号: US10646458申请日: 2003-08-22
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公开(公告)号: US07137354B2公开(公告)日: 2006-11-21
- 发明人: Kenneth S. Collins , Hiroji Hanawa , Kartik Ramaswamy , Andrew Nguyen , Amir Al-Bayati , Biagio Gallo , Gonzalo Antonio Monroy
- 申请人: Kenneth S. Collins , Hiroji Hanawa , Kartik Ramaswamy , Andrew Nguyen , Amir Al-Bayati , Biagio Gallo , Gonzalo Antonio Monroy
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Law Office of Robert M. Wallace
- 主分类号: G23C16/00
- IPC分类号: G23C16/00 ; C23F1/00
摘要:
A plasma immersion ion implantation reactor for ion implanting a species into a surface layer of a workpiece includes an enclosure which has a side wall and a ceiling defining a chamber and a workpiece support pedestal within the chamber having a workpiece support surface facing the ceiling and defining a process region extending generally across the wafer support pedestal and confined laterally by the side wall and axially between the workpiece support pedestal and the ceiling. The enclosure has at least a first pair of openings at generally opposite sides of the process region and a first hollow conduit outside of the chamber having first and second ends connected to respective ones of the first pair of openings, so as to provide a first reentrant path extending through the conduit and across said process region. A gas distribution apparatus is provided on or near an interior surface of the reactor for introducing a process gas containing the species to be ion implanted and a first RE plasma source power applicator for generating a plasma in the chamber.
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