发明授权
- 专利标题: Semiconductor device and manufacturing method thereof
- 专利标题(中): 半导体装置及其制造方法
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申请号: US10740232申请日: 2003-12-18
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公开(公告)号: US07138689B2公开(公告)日: 2006-11-21
- 发明人: Tsuyoshi Inoue , Hiroshi Yamamoto , Mitsuru Yoshikawa , Saiki Hotate
- 申请人: Tsuyoshi Inoue , Hiroshi Yamamoto , Mitsuru Yoshikawa , Saiki Hotate
- 申请人地址: US TX Dallas
- 专利权人: Texas Instruments Incorporated
- 当前专利权人: Texas Instruments Incorporated
- 当前专利权人地址: US TX Dallas
- 代理商 Jacqueline J. Garner; W. James Brady, III; Frederick J. Telecky, Jr.
- 优先权: JP2002-375027 20021225
- 主分类号: H01L29/78
- IPC分类号: H01L29/78
摘要:
A semiconductor substrate that has a MOS transistor with a high breakdown voltage having double sidewall insulation films and can inhibit negative effects on the electric characteristics and method thereof. The semiconductor device is formed as a transistor with a configuration having gate insulation film 21 and gate electrode 22 formed on semiconductor substrate 10, inner sidewall insulation film 25 formed at least on part of the gate insulation film and on both sides of the gate electrode, outer sidewall insulation film 26 formed at least on part of the gate insulation film and on both sides of the inner sidewall insulation film, low concentration impurity area 23 containing an impurity at a low concentration and formed in the semiconductor substrate in the area underneath the inner sidewall insulation film and the outer sidewall insulation film, and high concentration impurity area 27 containing an impurity at a concentration higher than the low concentration impurity area and formed in the semiconductor substrate in the area underneath both sides of the outer sidewall insulation film.
公开/授权文献
- US20040150066A1 Semiconductor device and manufacturing method thereof 公开/授权日:2004-08-05
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