Invention Grant
- Patent Title: Barrier layers for microelectromechanical systems
- Patent Title (中): 微机电系统的阻隔层
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Application No.: US10969380Application Date: 2004-10-19
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Publication No.: US07138693B2Publication Date: 2006-11-21
- Inventor: Satyadev Patel , Jonathan Doan , Andrew Huibers
- Applicant: Satyadev Patel , Jonathan Doan , Andrew Huibers
- Applicant Address: US CA Sunnyvale
- Assignee: Reflectivity, Inc.
- Current Assignee: Reflectivity, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Gregory R. Muir
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L29/82 ; H01L29/84
Abstract:
A method for processing microelectromechanical devices is disclosed herein. The method prevents the diffusion and interaction between sacrificial layers and structure layers of the microelectromechanical devices by providing selected barrier layers between consecutive sacrificial and structure layers.
Public/Granted literature
- US20050054135A1 Barrier layers for microelectromechanical systems Public/Granted day:2005-03-10
Information query
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