发明授权
- 专利标题： Barrier layers for microelectromechanical systems
- 专利标题（中）： 微机电系统的阻隔层
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申请号： US10969380申请日： 2004-10-19
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公开(公告)号： US07138693B2公开(公告)日： 2006-11-21
- 发明人: Satyadev Patel , Jonathan Doan , Andrew Huibers
- 申请人： Satyadev Patel , Jonathan Doan , Andrew Huibers
- 申请人地址： US CA Sunnyvale
- 专利权人： Reflectivity, Inc.
- 当前专利权人： Reflectivity, Inc.
- 当前专利权人地址： US CA Sunnyvale
- 代理商 Gregory R. Muir
- 主分类号： H01L27/14
- IPC分类号： H01L27/14 ; H01L29/82 ; H01L29/84
摘要：
A method for processing microelectromechanical devices is disclosed herein. The method prevents the diffusion and interaction between sacrificial layers and structure layers of the microelectromechanical devices by providing selected barrier layers between consecutive sacrificial and structure layers.
公开/授权文献
- US20050054135A1 Barrier layers for microelectromechanical systems 公开/授权日：2005-03-10