发明授权
- 专利标题： Microelectronic package array
- 专利标题（中）： 微电子封装阵列
-
申请号： US10663485申请日： 2003-09-15
-
公开(公告)号： US07138709B2公开(公告)日： 2006-11-21
- 发明人: Takashi Kumamoto
- 申请人： Takashi Kumamoto
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Schwabe, Williamson & Wyatt, P.C.
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
This invention relates to an apparatus and method for increasing microelectronic package density by stacking multiple microelectronic packages in an array and controlling package to package scalability without stressing the carrier substrates and without limiting the number of signal and input/output leads. Specifically, an intermediate substrate having conductive risers therein is used to enable pitch control of the package to package interconnection, control of the standoff distance and act as a microelectronic package stiffener.
公开/授权文献
- US20040262729A1 Microelectronic package array 公开/授权日：2004-12-30
信息查询
IPC分类:
