发明授权
- 专利标题： Heat sink with heat pipe in direct contact with component
- 专利标题（中）： 散热器与热管直接接触组件
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申请号： US10246299申请日： 2002-09-17
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公开(公告)号： US07140422B2公开(公告)日： 2006-11-28
- 发明人: Christopher G. Malone , Harold Miyamura
- 申请人： Christopher G. Malone , Harold Miyamura
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： F28D15/00
- IPC分类号： F28D15/00
摘要：
A heat sink includes a heat pipe and a base adapted to allow the heat pipe to directly contact a component. By directly contacting the component, thermal efficiency is increased. Furthermore, increasing the surface area of the heat pipe that is in direct contact with the component also increases thermal efficiency.
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