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公开(公告)号：US07542296B1
公开(公告)日：2009-06-02
申请号：US11280150
申请日：2005-11-16
申请人： David J. Baik , George Feltovich , Brad Reger , David Willheim , Harold Miyamura
发明人： David J. Baik , George Feltovich , Brad Reger , David Willheim , Harold Miyamura
CPC分类号： H05K5/0252
摘要： A system of keying implementation for swapping paired devices is provided. The system includes a controller module having a first keying member, a power supply unit having a second keying member, and a chassis having a plurality of receiving slots for receiving the controller module and the power supply unit. When the controller module and the power supply unit are a matched pair and when the controller module and the power supply unit are fully inserted, next to each other, into the plurality of receiving slots, the first keying member and the second keying member do not interfere with each other so that the power supply unit may supply power to the controller module.
摘要翻译： 提供了一种交换配对设备的密钥实现系统。 该系统包括具有第一键控构件的控制器模块，具有第二键控构件的电源单元和具有用于接收控制器模块和电源单元的多个接收槽的底架。 当控制器模块和电源单元是匹配对，并且当控制器模块和电源单元完全插入到彼此相邻时，多个接收槽中，第一键控构件和第二键控构件不 彼此干扰，使得电源单元可以向控制器模块供电。
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公开(公告)号：US07140422B2
公开(公告)日：2006-11-28
申请号：US10246299
申请日：2002-09-17
IPC分类号： F28D15/00
CPC分类号： H01L23/427 , F28D15/0275 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A heat sink includes a heat pipe and a base adapted to allow the heat pipe to directly contact a component. By directly contacting the component, thermal efficiency is increased. Furthermore, increasing the surface area of the heat pipe that is in direct contact with the component also increases thermal efficiency.
摘要翻译： 散热器包括热管和适于允许热管直接接触部件的底座。 通过直接接触组件，热效率提高。 此外，增加与部件直接接触的热管的表面积也提高了热效率。
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公开(公告)号：USD485843S1
公开(公告)日：2004-01-27
申请号：US29171299
申请日：2002-11-20
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4.发明授权公开(公告)号：US07389599B2
公开(公告)日：2008-06-24
申请号：US10365258
申请日：2003-02-12
申请人： David S. Hishinuma , Ken G. Robertson , Dustin Rosing , Richard W. Davis , Harold Miyamura , Jorge E. Rocabado
发明人： David S. Hishinuma , Ken G. Robertson , Dustin Rosing , Richard W. Davis , Harold Miyamura , Jorge E. Rocabado
IPC分类号： B42F17/34
CPC分类号： G09F3/20
摘要： In one embodiment, there is shown a system and method of allowing a user to gain access to information pertaining to certain equipment by pulling a label out of an opening in a surface of the equipment, viewing information on the label; and pushing the label back into the opening. In a further embodiment, the label is captive to the equipment independent from a bezel surrounding the equipment. In a still further embodiment of the invention, the label has on it pre-established information pertaining to the equipment, as well as user added information.
摘要翻译： 在一个实施例中，示出了允许用户通过从设备的表面中的开口拉出标签以查看标签上的信息来允许用户访问与某些设备有关的信息的系统和方法; 并将标签推回开口。 在另一个实施例中，该标签是独立于围绕设备的边框的独立设备的。 在本发明的另一个实施例中，标签具有与设备有关的预先建立的信息以及用户添加的信息。
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公开(公告)号：US07312999B1
公开(公告)日：2007-12-25
申请号：US11118935
申请日：2005-04-29
CPC分类号： G06F1/181 , G06F1/187 , G11B33/125 , G11B33/128
摘要： The present invention is an apparatus for supporting the dense integration of a plurality of multi-drive modules. A chassis assembly of the present invention may house a plurality of multi-drive modules whereby each multi-drive module may house multiple drives. Each multi-drive module may be easily removed from the chassis for reduced serviceability time. Each drive may be housed within a carrier assembly, the carrier assembly being easily removed from the multi-drive module of the present invention. Advantageously, a dense integration of drives may be achieved while providing proper ventilation and vibration dampening.
摘要翻译： 本发明是一种用于支持多个多驱动模块的密集集成的装置。 本发明的底盘组件可以容纳多个多驱动模块，由此每个多驱动模块可容纳多个驱动器。 每个多驱动器模块可以容易地从底盘移除以减少可维护时间。 每个驱动器可以容纳在载体组件内，载体组件容易地从本发明的多驱动模块中移除。 有利地，可以在提供适当的通风和减振的同时实现驱动器的密集集成。
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公开(公告)号：US07143819B2
公开(公告)日：2006-12-05
申请号：US10246343
申请日：2002-09-17
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A heat sink comprises a base having a substantially flat region for interfacing with an electronic component, and at least one heat pipe having a first region substantially parallel to the flat region of the base and a second region substantially perpendicular to the flat region of the base. By providing a heat pipe in a heat sink that is L-shaped or U-shaped, a greater portion of the heat pipe is in contact with the heat-generating electronic component. As a result, thermal efficiency increases because there is more direct contact with the heat pipe.
摘要翻译： 散热器包括具有用于与电子部件接口的基本上平坦的区域的基座和至少一个热管，该热管具有基本上平行于基部的平坦区域的第一区域和基本上垂直于基部的平坦区域的第二区域 。 通过在散热器中设置L形或U形的热管，较大部分的热管与发热电子部件接触。 因此，热效率增加，因为与热管有更直接的接触。
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公开(公告)号：US20050088825A1
公开(公告)日：2005-04-28
申请号：US10690789
申请日：2003-10-22
申请人： Harold Miyamura , Michael Wortman
发明人： Harold Miyamura , Michael Wortman
摘要： A computing device module for receipt within a computing device chassis includes an enclosure and a handle movably coupled to the enclosure. The handle moves between an extended position and a retracted position. The handle includes at least one opening configured to permit at least one hand digit to extend through the at least one opening when the handle is in the retracted position.
摘要翻译： 用于在计算设备底盘内接收的计算设备模块包括外壳和可移动地联接到外壳的手柄。 手柄在延伸位置和缩回位置之间移动。 手柄包括至少一个开口，其构造成当手柄处于缩回位置时允许至少一个手数位置延伸穿过至少一个开口。
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8.发明授权公开(公告)号：US06758679B2
公开(公告)日：2004-07-06
申请号：US10124999
申请日：2002-04-17
申请人： Harold Miyamura , David Hishinuma , Junichi Kato
发明人： Harold Miyamura , David Hishinuma , Junichi Kato
IPC分类号： G09B1900
CPC分类号： G09B25/00
摘要： An installation instruction conveying device. In one embodiment, the installation instruction conveying device is comprised of a first surface having instructions visibly disposed thereon for installing a component. The installation instruction conveying device is further comprised of a means for adhering said installation instruction conveying device to a component installation location. The installation instruction conveying device prevents the installation of the component at the component installation location unless the installation instruction conveying device is removed from said component installation location.
摘要翻译： 安装指导传送装置。 在一个实施例中，安装指令传送装置包括具有可见地设置在其上的用于安装部件的指令的第一表面。 安装指导传送装置还包括用于将安装指示传送装置粘附到部件安装位置的装置。 安装指示传送装置防止组件安装在组件安装位置，除非安装说明传送装置从组件安装位置移除。
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公开(公告)号：USD546827S1
公开(公告)日：2007-07-17
申请号：US29182196
申请日：2003-05-21
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公开(公告)号：US06992893B2
公开(公告)日：2006-01-31
申请号：US10340369
申请日：2003-01-10
申请人： Harold Miyamura , Rong-Che Chen
发明人： Harold Miyamura , Rong-Che Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44026 , H01L2924/00
摘要： An apparatus in one example comprises one or more adhesives that serve to provide at least primary attachment of a heat sink with one or more electrical components coupled with a circuit board.
摘要翻译： 在一个示例中的装置包括一个或多个粘合剂，其用于至少提供散热器的主要附接和与电路板耦合的一个或多个电气部件。
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