发明授权
- 专利标题: BGA connector assembly
- 专利标题(中): BGA连接器总成
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申请号: US11293972申请日: 2005-12-05
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公开(公告)号: US07140901B2公开(公告)日: 2006-11-28
- 发明人: Nick Lin , Yu-Chen Chen
- 申请人: Nick Lin , Yu-Chen Chen
- 申请人地址: TW Taipei Hsien
- 专利权人: Hon Hai Precision Ind. Co., Ltd.
- 当前专利权人: Hon Hai Precision Ind. Co., Ltd.
- 当前专利权人地址: TW Taipei Hsien
- 代理商 Wei Te Chung
- 优先权: TW93219492U 20041203
- 主分类号: H01R13/62
- IPC分类号: H01R13/62
摘要:
Disclosed is a BGA connector assembly including an insulative housing (11) with a plurality of terminals (15) in electrical connection with corresponding solder balls (3) that extend from a surface of the housing. The solder balls form a soldering region (30) for attachment to a printed circuit board. The whole electrical connector assembly has a center of gravity biased from a center of the soldering region, and at least one recess (111) is formed in the housing. The at least one recess prevents the connector assembly from becoming inclined with respect to the printed circuit board when the solder balls are attached to the printed circuit board.
公开/授权文献
- US20060121764A1 BGA connector assembly 公开/授权日:2006-06-08
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