Invention Grant
US07144239B2 Molding apparatus with a molding flowability sensor for packaging semiconductor device
有权
具有用于封装半导体器件的成型流动性传感器的成型装置
- Patent Title: Molding apparatus with a molding flowability sensor for packaging semiconductor device
- Patent Title (中): 具有用于封装半导体器件的成型流动性传感器的成型装置
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Application No.: US10901039Application Date: 2004-07-29
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Publication No.: US07144239B2Publication Date: 2006-12-05
- Inventor: Wei-Chih Wang , Kuang-Lin Lo , Yun-Lung Chang
- Applicant: Wei-Chih Wang , Kuang-Lin Lo , Yun-Lung Chang
- Applicant Address: TW Kaoshiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaoshiung
- Agency: Bacon & Thomas, PLLC
- Priority: TW92129689A 20031024
- Main IPC: B29C45/77
- IPC: B29C45/77
Abstract:
A molding apparatus mainly comprises a mold chase holder, a mold chase, a heater and a molding flowability sensor. The mold chase comprises a mold cavity and a via, wherein the via penetrates a mold-cavity surface of the mold cavity. The mold chase is accommodated by a mold chase holder and there is a heater, for heating the mold chase up, disposed therein. And the molding flowability sensor for measuring the molding flowability of the instant molding flow at the mold-cavity surface of the mold cavity is provided at the mold-cavity surface of the mold cavity.
Public/Granted literature
- US20050089594A1 Molding appartus with a molding flowability sensor for packaging semiconductor device Public/Granted day:2005-04-28
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