发明授权
- 专利标题： Thermal treatment apparatus
- 专利标题（中）： 热处理设备
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申请号： US10494970申请日： 2002-09-27
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公开(公告)号： US07144823B2公开(公告)日： 2006-12-05
- 发明人: Takanori Saito , Toshiyuki Makiya , Hisaei Osanai , Tsuyoshi Takizawa , Tomohisa Shimazu , Kazuhide Hasebe , Hiroyuki Yamamoto , Yukimasa Saito , Kenichi Yamaga
- 申请人： Takanori Saito , Toshiyuki Makiya , Hisaei Osanai , Tsuyoshi Takizawa , Tomohisa Shimazu , Kazuhide Hasebe , Hiroyuki Yamamoto , Yukimasa Saito , Kenichi Yamaga
- 申请人地址： JP Tokyo-To
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo-To
- 代理机构： Smith, Gambrell & Russell, LLP
- 优先权： JP2001-342636 20011108; JP2002-088182 20020327
- 国际申请： PCT/JP02/10079 WO 20020927
- 国际公布： WO03/041139 WO 20030515
- 主分类号： H01L21/31
- IPC分类号： H01L21/31
摘要：
The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a heating unit provided on an inside wall of the heating-furnace body; a reaction container consisting of a single tube contained in the heating-furnace body; a gas-discharging-pipe connecting portion formed at an upper portion of the reaction container; and a first temperature controlling unit provided around the gas-discharging-pipe connecting portion.
公开/授权文献
- US20050028738A1 Thermal treating apparatus 公开/授权日：2005-02-10