Invention Grant
- Patent Title: Thermal treatment apparatus
- Patent Title (中): 热处理设备
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Application No.: US10494970Application Date: 2002-09-27
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Publication No.: US07144823B2Publication Date: 2006-12-05
- Inventor: Takanori Saito , Toshiyuki Makiya , Hisaei Osanai , Tsuyoshi Takizawa , Tomohisa Shimazu , Kazuhide Hasebe , Hiroyuki Yamamoto , Yukimasa Saito , Kenichi Yamaga
- Applicant: Takanori Saito , Toshiyuki Makiya , Hisaei Osanai , Tsuyoshi Takizawa , Tomohisa Shimazu , Kazuhide Hasebe , Hiroyuki Yamamoto , Yukimasa Saito , Kenichi Yamaga
- Applicant Address: JP Tokyo-To
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo-To
- Agency: Smith, Gambrell & Russell, LLP
- Priority: JP2001-342636 20011108; JP2002-088182 20020327
- International Application: PCT/JP02/10079 WO 20020927
- International Announcement: WO03/041139 WO 20030515
- Main IPC: H01L21/31
- IPC: H01L21/31
Abstract:
The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a heating unit provided on an inside wall of the heating-furnace body; a reaction container consisting of a single tube contained in the heating-furnace body; a gas-discharging-pipe connecting portion formed at an upper portion of the reaction container; and a first temperature controlling unit provided around the gas-discharging-pipe connecting portion.
Public/Granted literature
- US20050028738A1 Thermal treating apparatus Public/Granted day:2005-02-10
Information query
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