发明授权
- 专利标题: Semiconductor device and method of manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US11117337申请日: 2005-04-29
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公开(公告)号: US07145197B2公开(公告)日: 2006-12-05
- 发明人: Masaru Kidoh , Hideaki Aochi , Ryota Katsumata , Masaru Kito , Hitomi Yasutake
- 申请人: Masaru Kidoh , Hideaki Aochi , Ryota Katsumata , Masaru Kito , Hitomi Yasutake
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权: JP2005-044125 20050221
- 主分类号: H01L27/108
- IPC分类号: H01L27/108
摘要:
A semiconductor device includes a semiconductor substrate, a trench formed in the semiconductor substrate, an island-like element region formed in the semiconductor substrate, having an upper surface, first to third side surfaces, an upper portion, a middle portion and a lower portion, a gate insulating film formed on the first to third side surfaces in the upper portion of the element region, a gate electrode having first and second bottom surfaces, a first diffusion layer formed along the upper surface of the element region, a second diffusion layer formed along the first side surface in the middle portion of the element region, a channel region having first to third regions formed along the first to third side surfaces in the upper portion of the element region, a capacitor formed in the trench, and a bit line electrically connected to the first diffusion layer.
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