Semiconductor device and method of manufacturing the same

    公开(公告)号:US20060189070A1

    公开(公告)日:2006-08-24

    申请号:US11117337

    申请日:2005-04-29

    IPC分类号: H01L21/8242

    摘要: A semiconductor device includes a semiconductor substrate, a trench formed in the semiconductor substrate, an island-like element region formed in the semiconductor substrate, having an upper surface, first to third side surfaces, an upper portion, a middle portion and a lower portion, a gate insulating film formed on the first to third side surfaces in the upper portion of the element region, a gate electrode having first and second bottom surfaces, a first diffusion layer formed along the upper surface of the element region, a second diffusion layer formed along the first side surface in the middle portion of the element region, a channel region having first to third regions formed along the first to third side surfaces in the upper portion of the element region, a capacitor formed in the trench, and a bit line electrically connected to the first diffusion layer.

    Semiconductor device and method of manufacturing the same
    2.
    发明授权
    Semiconductor device and method of manufacturing the same 失效
    半导体装置及其制造方法

    公开(公告)号:US07145197B2

    公开(公告)日:2006-12-05

    申请号:US11117337

    申请日:2005-04-29

    IPC分类号: H01L27/108

    摘要: A semiconductor device includes a semiconductor substrate, a trench formed in the semiconductor substrate, an island-like element region formed in the semiconductor substrate, having an upper surface, first to third side surfaces, an upper portion, a middle portion and a lower portion, a gate insulating film formed on the first to third side surfaces in the upper portion of the element region, a gate electrode having first and second bottom surfaces, a first diffusion layer formed along the upper surface of the element region, a second diffusion layer formed along the first side surface in the middle portion of the element region, a channel region having first to third regions formed along the first to third side surfaces in the upper portion of the element region, a capacitor formed in the trench, and a bit line electrically connected to the first diffusion layer.

    摘要翻译: 半导体器件包括半导体衬底,形成在半导体衬底中的沟槽,形成在半导体衬底中的岛状元件区,具有上表面,第一至第三侧表面,上部,中部和下部 形成在元件区域的上部的第一至第三侧面上的栅极绝缘膜,具有第一和第二底面的栅电极,沿着元件区域的上表面形成的第一扩散层,第二扩散层 沿着元件区域的中间部分中的第一侧表面形成有沿元件区域的上部中的第一至第三侧表面形成的第一至第三区域的沟道区域,形成在沟槽中的电容器,以及位 电线连接到第一扩散层。

    Non-volatile semiconductor storage device and method of manufacturing the same
    4.
    发明授权
    Non-volatile semiconductor storage device and method of manufacturing the same 有权
    非易失性半导体存储装置及其制造方法

    公开(公告)号:US08426976B2

    公开(公告)日:2013-04-23

    申请号:US12392636

    申请日:2009-02-25

    IPC分类号: H01L29/792 H01L21/28

    摘要: A non-volatile semiconductor storage device has a plurality of memory strings with a plurality of electrically rewritable memory cells connected in series. Each of the memory strings includes: a columnar semiconductor layer extending in a direction perpendicular to a substrate; a plurality of conductive layers formed at a sidewall of the columnar semiconductor layer via memory layers; and interlayer insulation layers formed above of below the conductive layers. A sidewall of the conductive layers facing the columnar semiconductor layer is formed to be inclined such that the distance thereof from a central axis of the columnar semiconductor layer becomes larger at lower position thereof than at upper position thereof. While, a sidewall of the interlayer insulation layers facing the columnar semiconductor layer is formed to be inclined such that the distance thereof from a central axis of the columnar semiconductor layer becomes smaller at lower position thereof than at upper position thereof.

    摘要翻译: 非易失性半导体存储装置具有多个具有串联连接的多个电可重写存储单元的存储器串。 每个存储器串包括:在垂直于衬底的方向上延伸的柱状半导体层; 多个导电层,经由存储层形成在所述柱状半导体层的侧壁处; 以及形成在导电层下方的层间绝缘层。 形成面向柱状半导体层的导电层的侧壁,使得其与柱状半导体层的中心轴的距离在其下部位置比在其上部位置变大。 同时,面对柱状半导体层的层间绝缘层的侧壁形成为倾斜,使得其在柱状半导体层的中心轴线处的距离在其下部位置处比在其上部位置变小。

    Semiconductor memory device and method for fabricating semiconductor memory device
    6.
    发明授权
    Semiconductor memory device and method for fabricating semiconductor memory device 有权
    半导体存储器件及半导体存储器件的制造方法

    公开(公告)号:US08350314B2

    公开(公告)日:2013-01-08

    申请号:US12325711

    申请日:2008-12-01

    IPC分类号: H01L29/792

    摘要: According to an aspect of the present invention, there is provided a nonvolatile semiconductor memory device, comprising a plurality of memory strings, each of the memory strings being constituted with a plurality of electrically erasable memory cells being serially connected each other, the memory strings comprising: a columnar semiconductor layer perpendicularly extending toward a substrate; a plurality of conductive layers being formed in parallel to the substrate and including a first space between a sidewall of the columnar semiconductor layers; and characteristic change layer being formed on the sidewall of the columnar semiconductor layer faced to the first space or a sidewall of the conductive layer faced to the first space and changing characteristics accompanying with applied voltage; wherein the plurality of the conductive layers have a function of a relative movement to a prescribed direction for the columnar semiconductor layer.

    摘要翻译: 根据本发明的一个方面,提供了一种非易失性半导体存储器件,包括多个存储器串,每个存储器串由多个电可擦除存储器单元组成,所述多个电可擦除存储器单元串联连接,所述存储器串包括 :向衬底垂直延伸的柱状半导体层; 多个导电层平行于衬底形成并且包括柱状半导体层的侧壁之间的第一空间; 并且特征变化层形成在面向面向第一空间的导电层的第一空间或侧壁的柱状半导体层的侧壁上,并且伴随施加电压的变化特性; 其中所述多个所述导电层具有对于所述柱状半导体层相对于规定方向的相对移动的功能。

    Nonvolatile semiconductor memory device and method of manufacturing the same
    7.
    发明授权
    Nonvolatile semiconductor memory device and method of manufacturing the same 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US08334561B2

    公开(公告)日:2012-12-18

    申请号:US12709702

    申请日:2010-02-22

    IPC分类号: H01L29/72

    摘要: A memory string comprises: a first semiconductor layer having a plurality of columnar portions extending in a perpendicular direction with respect to a substrate, and joining portions joining lower ends of the plurality of columnar portions; a charge storage layer surrounding a side surface of the first semiconductor layer; and a first conductive layer surrounding a side surface of the charge storage layer and functioning as a control electrode of memory cells. A select transistor comprises: a second semiconductor layer extending upwardly from an upper surface of the columnar portions; an insulating layer surrounding a side surface of the second semiconductor layer; a second conductive layer surrounding a side surface of the insulating layer and functioning as a control electrode of the select transistors; and a third semiconductor layer formed on an upper surface of the second semiconductor layer and including silicon germanium.

    摘要翻译: 存储器串包括:第一半导体层,具有相对于衬底在垂直方向上延伸的多个柱状部分,以及连接多个柱状部分的下端的接合部分; 围绕所述第一半导体层的侧表面的电荷存储层; 以及围绕电荷存储层的侧表面并用作存储单元的控制电极的第一导电层。 选择晶体管包括:从柱状部分的上表面向上延伸的第二半导体层; 围绕所述第二半导体层的侧表面的绝缘层; 围绕所述绝缘层的侧表面并用作所述选择晶体管的控制电极的第二导电层; 以及形成在所述第二半导体层的上表面上并且包括硅锗的第三半导体层。

    Non-volatile semiconductor memory device and method of manufacturing the same
    9.
    发明授权
    Non-volatile semiconductor memory device and method of manufacturing the same 失效
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US08330216B2

    公开(公告)日:2012-12-11

    申请号:US12345088

    申请日:2008-12-29

    IPC分类号: H01L29/66

    摘要: A non-volatile semiconductor memory device includes a first columnar semiconductor layer and a plurality of first conductive layers formed such that a charge storage layer for storing charges is sandwiched between the first conductive layers and the first columnar semiconductor layer. Also, the non-volatile semiconductor memory device includes a second columnar semiconductor layer and a second conductive layer formed such that an insulating layer is sandwiched between the second conductive layer and the second columnar semiconductor layer, the second conductive layer being repeatedly provided in a line form by providing a certain interval in a first direction perpendicular to a laminating direction. A first sidewall conductive layer being in contact with the second conductive layer and extending in the first direction is formed on a sidewall along a longitudinal direction of the second conductive layer.

    摘要翻译: 非挥发性半导体存储器件包括第一柱状半导体层和形成为使得用于存储电荷的电荷存储层夹在第一导电层和第一柱状半导体层之间的多个第一导电层。 此外,非挥发性半导体存储器件包括第二柱状半导体层和形成为使得绝缘层夹在第二导电层和第二柱状半导体层之间的第二导电层,第二导电层重复地设置在一行中 通过在与层叠方向垂直的第一方向上设置一定间隔来形成。 沿着第二导电层的纵向方向在侧壁上形成与第二导电层接触并沿第一方向延伸的第一侧壁导电层。

    Nonvolatile semiconductor memory device and method for manufacturing the same
    10.
    发明授权
    Nonvolatile semiconductor memory device and method for manufacturing the same 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US08274108B2

    公开(公告)日:2012-09-25

    申请号:US12705231

    申请日:2010-02-12

    IPC分类号: H01L29/788 H01L21/336

    摘要: A nonvolatile semiconductor memory device, includes: a stacked body including a plurality of insulating films alternately stacked with a plurality of electrode films, the electrode films being divided to form a plurality of control gate electrodes aligned in a first direction; a plurality of semiconductor pillars aligned in a stacking direction of the stacked body, the semiconductor pillars being arranged in a matrix configuration along the first direction and a second direction intersecting the first direction to pierce the control gate electrodes; and a connection member connecting a lower end portion of one of the semiconductor pillars to a lower end portion of one other of the semiconductor pillars, an upper end portion of the one of the semiconductor pillars being connected to a source line, an upper end portion of the one other of the semiconductor pillars being connected to a bit line. At least some of the control gate electrodes are pierced by two of the semiconductor pillars adjacent to each other in the second direction. Two of the semiconductor pillars being connected to each other by the connection member pierce mutually different control gate electrodes.

    摘要翻译: 一种非易失性半导体存储器件,包括:堆叠体,包括交替层叠有多个电极膜的多个绝缘膜,所述电极膜被分割以形成沿第一方向排列的多个控制栅电极; 多个半导体柱沿堆叠体的堆叠方向排列,半导体柱沿着第一方向以矩阵构造排列,第二方向与第一方向相交以刺穿控制栅电极; 以及将所述半导体柱之一的下端部连接到所述半导体柱的另一个的下端部的连接部件,所述一个半导体柱的上端部与源极线连接,上端部 另一个半导体柱被连接到位线。 至少一些控制栅极电极在第二方向上被彼此相邻的两个半导体柱刺穿。 通过连接构件彼此连接的两个半导体柱穿透彼此不同的控制栅电极。