发明授权
- 专利标题： Apparatus and method for evaluating semiconductor material
- 专利标题（中）： 用于评估半导体材料的装置和方法
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申请号： US10635539申请日： 2003-08-07
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公开(公告)号： US07145658B2公开(公告)日： 2006-12-05
- 发明人: Haruko Akutsu , Katsumi Rikimaru , Kyoichi Suguro , Tatsuya Shima , Yoshimasa Kawase , Atsushi Murakoshi
- 申请人： Haruko Akutsu , Katsumi Rikimaru , Kyoichi Suguro , Tatsuya Shima , Yoshimasa Kawase , Atsushi Murakoshi
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权： JP2003-100442 20030403
- 主分类号： G01N21/41
- IPC分类号： G01N21/41
摘要：
An apparatus for evaluating semiconductor material having a pump laser configured to irradiate a pump beam modulated at a modulation frequency on a semiconductor wafer, a probe laser configured to irradiate a probe beam on the semiconductor wafer, and a detector configured to detect a reflection of the probe beam from the semiconductor wafer.