Invention Grant
US07148129B2 Method of growing selective area by metal organic chemical vapor deposition
有权
通过金属有机化学气相沉积生长选择性区域的方法
- Patent Title: Method of growing selective area by metal organic chemical vapor deposition
- Patent Title (中): 通过金属有机化学气相沉积生长选择性区域的方法
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Application No.: US10805790Application Date: 2004-03-22
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Publication No.: US07148129B2Publication Date: 2006-12-12
- Inventor: Young-Churl Bang , Eun-Hwa Lee , Hyeon-Soo Kim , Jung-Kee Lee , Jun-Youn Kim
- Applicant: Young-Churl Bang , Eun-Hwa Lee , Hyeon-Soo Kim , Jung-Kee Lee , Jun-Youn Kim
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: Cha & Reiter, L.L.C.
- Priority: KR10-2003-0081038 20031117
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
A method of growing a semiconductor layer in a selective area by Metal Organic Chemical Vapor Deposition (MOCVD) and a mask pattern for s ame, includes a first mask pattern and a second mask pattern that are formed on a semiconductor substrate having a (100) crystalline plane. The first mask pattern has a first window wider than the selective area and a second mask pattern has a second window and a third window. The second window is defined by spacing the second mask pattern from the first mask pattern, in correspondence with a blocking area for blocking the surface migration of III-group semiconductor source gases at edges of the first window. The third window is as wide as the selective area. The semiconductor layer is grown by MOCVD on the semiconductor substrate exposed by the second and third windows. Trenches can be etched in the second and third windows and growth layers extend from the trench beyond the surface of the InP to block gas dispersion.
Public/Granted literature
- US20050103259A1 Method of growing selective area by metal organic chemical vapor deposition Public/Granted day:2005-05-19
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